ii
Checklist
Contents
IPILP-AR specications summary ............................................................ iii
1. Motherboard layout ......................................................................... 1
2. Central Processing Unit (CPU) ...................................................... 2
2.1 Enhanced Intel SpeedStep
®
Technology (EIST) ..................... 2
2.2 Installing the CPU ..................................................................... 3
3. System memory .............................................................................. 5
3.1 Memory congurations ............................................................ 5
3.2 Installing a DIMM ....................................................................... 6
3.3 Removing a DIMM ..................................................................... 6
4. Expansion slots ............................................................................... 7
5. Jumper ............................................................................................. 8
6. Connectors.......................................... .......................................... 10
6.1 Rear panel connectors ........................................................... 10
6.2 Internal connectors ................................................................. 12
E3030
First Edition V1
January 2007