BBK DK1000S - Page 18

A
CONNECTION DIAGRAMS
Special Handling Instructions
Special handling is required for Flash Memory products
in FBGA packages.
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
The package and/or data integrity may be compromised
if the package body is exposed to temperatures above
150°C for prolonged periods of time.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
RESET#
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CE#
V
SS
OE#
DQ0
DQ8
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
WE#
A19
A8
A9
A10
A11
A12
A13
A14
A15
A16
BYTE#
V
SS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
V
CC
SO
A1 B1 C1 D1 E1 F1 G1 H1
A2 B2 C2 D2 E2 F2 G2 H2
A3 B3 C3 D3 E3 F3 G3 H3
A4 B4 C4 D4 E4 F4 G4 H4
A5 B5 C5 D5 E5 F5 G5 H5
A6 B6 C6 D6 E6 F6 G6 H6
DQ15/A-1 V
SS
BYTE#A16A15A14A12A13
DQ13 DQ6DQ14DQ7A11A10A8A9
V
CC
DQ4DQ12DQ5A19NCRESET#WE#
DQ11 DQ3DQ10DQ2NCA18NCRY/BY#
DQ9 DQ1DQ8DQ0A5A6A17A7
OE# V
SS
CE#A0A1A2A4A3
FBGA
Top View, Balls Facing Down