Blaupunkt MVP 01 - Page 6

P. How to read the Disassembly / Assembly
Procedures
(For Cabinet Part)
(For Mechanica! Part)
ae
a ae
® UNHOOK/UNLOCK/ RELEASE ADJUSTMENT
/UNPLUG/UNSOLDER -CONENON
ee
Ses, Alignment Procedures for
Mechanisa iten 13-2
aE SETTING PLATE it
(+) Sea, Aligrment Procedures tor
Mechanism (tee 13-2
2(C-1), 24P-1), 4(P-2) cMote 2> | (+) Sea, Setting Condition in Fig Dud
@®: Order of steps in Procedure
When reassembling, perform the step(s) in the reverse order.
These numbers are also used as the identification (location) No. of parts in Figures.
@®: Starting No. followed by corresponding part which can be removed at this stage.
See example below.
Example: Pressure Cam Cap can be removed without removing any other parts beca
Abseasiivar
thane
nadig
9
any
Pp
use
the
STEP/LOC.
No.
and
the
But Pressure Roller Arm Unit can be removed only after removing Pressure Cam Cap (No.@)
@: Part to be removed or installed.
@: Location of part.
T=Top; B=Bottom
®: Fig. No. showing Procedure or Part Location.
©: Identification of part to be removed, unhooked, unlocked, released, unplugged
d ' . 5 , , unclamped o}
P=Spring; W=Washer Bee atic
C=Cut Washer, A=Retaining Ring
N=Nut; S=Screw
% = Unhook, unlock, release, unplug or unsolder
2(C- 2)=2 Cut Washers (C- 2)
@: Adjustment information for installation.
# = Condition for adjustment
(+) : Refer to Exploded Views for Lubrication intormation.
Q. Replacement procedure for Leadiess (Chip)
Component
The
following
procedures
are
recommended
for
the
replace-
ment
of
the
leadiess
components
used
In
this
Unit.
4. Preparation for replacement
a. Soldering tron
Use
a
pencil-type
soldering
Iron
that
uses
less
than
30 watts.
b. Soider
Eutectic
Solder
(Tin
63%,
Lead
37%)
is
recom-
mended.
c. Soldering time
Do not apply heat for more than 4 seconds.
d. Preheating
Leadless capacitor must be preheated before Instal-
lation.
{130°C -150°C , for about two minutes.)
Note:
a. Leadless component must not be reused after
removal.
b. Excessive mechanical stress and rubbing of
the component electrode must be avoided.
2. Removing the leadiess component
Grasp the leadiess component body with tweezers and
alternately apply heat to both electrodes. When the
solder on both electrodes is melted, remove leadless
component with a twisting motion.
Note:
a. Do not attempt to lift the component off the board
until the component is completely disconnected
trom the board by a twisting action.
b. Take care not to break the copper foil on the
printed board.
Soldering Iron
Fig. 9
3. installing the jeadiess component
a. Presolder the contact points of the circuit board.
YA Soldering fron
Z_—~ Presoider
eal ee
Fig. 10
b. Press the part downward with tweezers and solder
both electrodes as shown below.
uv Wweezers
Glia Soldering tron
~—— Solder
Fig. 11
Note:
Do not glue the replacement leadiess component to the
circuit board.
R. How to remove / install the Flat Pack IC
1. How to remove the Flat Pack IC
(with Hot Air Flat Pack IC Desoldering Equipment)
(FOR EXAMPLE)
Fig. 12
(1) Prepare the Hot Air. Fiat Pack IC DESOLDERING
EQUIPMENT. And then apply hot air to Flat Pack IC
about 5~8 seconds,
(2) Remove the Flat Pack IC with tweezers while applying
the hot air.