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61
Appendix B Quick Commands
Layer property list
Materials: The material being applied during the deposition process. This entry
turns to “Custom” if the Density or Z-Factor is modied by the user.
Density [g/cm^3]: The density of the selected material being applied.
Z-Factor: Acoustic impedance factor which is used to compensate for dense
materials and is predened based on the selected material.
Tooling [%]: The geometric relationship between the substrate and the
positioning of the sensor.
Max Power [%]: Represents the maximum power level Eon™ will deliver to
the heater [from 0%-100%], regardless of the power levels being demanded by
temperature settings.
Proportional: The Proportional coefcient that controls the material deposition
rate during the PID phase.
Integral: The integral time constant that controls the material deposition rate
during PID phase.
Derivative: The derivative time constant that controls the material deposition
rate during the PID phase.
Dwell Time: The time specied that follows the completion of the predeposition
process and the activation of the PID. This delay prevents the PID from
engaging the source power prematurely, allowing the material to reach the
sensor. (No material is applied to the sensor directly after the predisposition
process nishes, for the brief time it takes for the material to initially transition
from the source to the crystal in the event that a shutter is present).
Rise to Soak Time: The time specifying how long it takes Eon™ to raise
source power from 0% to desired soak power
Soak Time: Once the soak power is reached, this is the time specifying how
long Eon™ sits at soak power before continuing to “Rise to Predeposit”.
Soak Power: The power percentage that the source will achieve during soak
process.
Rise to Predeposit: The time specifying how long it takes Eon to change the
current source power to the power percentage set for Predeposit.
Predeposit Time: The time specifying how long Eon™ will maintain the set
“Predeposit Power” before moving into dwell.
Predeposit Power: The power percentage that the source will achieve during
the Predeposit process.
Source: The source Eon™ uses to control the selected layer/material. The
Eon™ has two sources, Source 1 and Source 2.
Sensor: Determines which sensor should be used to control the source
selected for the current layer/material.