Dell OptiPlex XE3 - Chipset; Processor

Table 3. Chassis dimensions
Height (inches / centimeters) 13.8/35
Width (inches / centimeters) 6.10/15.40
Depth (inches / centimeters) 10.80/27.40
Shipping weight (pounds / kilograms – includes packaging
materials)
20.96/9.43
Table 4. Packaging parameters
Height (inches / centimeters) 13.19/33.50
Width (inches / centimeters) 19.40/49.40
Depth (inches / centimeters) 15.50/39.40
Identifier GUID-EC8A9E95-C43D-4876-8FEA-D0AC668DA773
Status Released
Chipset
Table 5. Chipset
specications
Type
Intel Q370
Non-volatile memory on chipset
Yes
BIOS conguration SPI (Serial Peripheral Interface)
256Mbit (32MB) located at SPI_FLASH on chipset
Trusted Platform Module (Discrete TPM Enabled) 24KB located at TPM 2.0 on chipset
Firmware TPM (Discrete TPM Disabled) Available in select countries
NIC EEPROM
LOM conguration contained within LOM e-fuse – no dedicated
LOM EEPROM
Identifier GUID-BF936DE0-097D-4B6E-AE2B-13B4C1263C29
Status Released
Processor
Global Standard Products (GSP) are a subset of Dell’s relationship products that are managed for availability and synchronized transitions
on a worldwide basis. They ensure the same platform is available for purchase globally. This allows customers to reduce the number of
congurations managed on a worldwide basis, thereby reducing their costs. They also enable companies to implement global IT standards
by locking in specic product congurations worldwide. The following GSP processors identied below will be made available to Dell
customers.
NOTE
: Processor numbers are not a measure of performance. Processor availability is subject to change and may vary by region/
country.
12 System specications