Dell PowerEdge 2950 Information Update

Information Update 15
LCD Status Messages Update
Table 1-2 lists updates to the LCD status messages that can occur on
the PowerEdge 2950 III system and the probable cause for each message.
The LCD messages refer to events recorded in the system event log (SEL).
For information on the SEL and configuring system management settings,
see your systems management software documentation.
Table 1-2. LCD Status Messages
Code Text Causes Corrective Actions
N/A SYSTEM NAME A 62-character string that
can be defined by the user
in the System Setup
program.
The SYSTEM NAME
displays under the
following conditions:
• The system
is powered on.
• The power is off
and active errors
are displayed.
This message is for
information only.
You can change
the system ID and
name in the System
Setup program.
See “Using the System
Setup Program” in the
Hardware Owner’s
Manual.
E1000 FAILSAFE,
Call Support
Check the system event
log for critical failure
events.
See “Getting Help” in
the Hardware Owner’s
Manual.
E1118 CPU Temp
Interface
The BMC is unable to
determine the CPU(s)
temperature status.
Consequently, the BMC
increases the CPU fan
speed to maximum
as a precautionary
measure.
Turn off power to the
system and restart the
system. If the problem
persists, see “Getting
Help” in the Hardware
Owner’s Manual.

Dell PowerEdge 2950 Specifications

General

Tcase	67 °C
Bus type	FSB
Stepping	E0
FSB Parity	Yes
Processor code	SLBBP
Processor cache	12 MB
Processor cores	4
Processor model	E5405
System bus rate	- GT/s
Processor series	Intel Xeon 5400 Series
Processor socket	LGA 771 (Socket J)
Processor codename	Harpertown
Motherboard chipset	Intel® 5000X
Processing Die size	214 mm²
Processor frequency	2 GHz
Processor cache type	L2
Processor lithography	45 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	1333 MHz
Processor operating modes	64-bit
ECC supported by processor	No
Thermal Design Power (TDP)	80 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	6
Number of Processing Die Transistors	820 M
HDD size	3.5 \
HDD capacity	160 GB
HDD interface	Serial ATA
Total storage capacity	3320 GB
Maximum storage capacity	6 TB
Graphics card	ES1000
Memory slots	8x DIMM
Internal memory	4 GB
Memory clock speed	667 MHz
Internal memory type	DDR2-SDRAM
Maximum internal memory	64 GB
Memory layout (slots x size)	2 x 2 GB
Maximum graphics card memory	16 MB
Networking features	Broadcom NetXtreme IITM 5708 Gigabit5 Ethernet NIC
Supported network protocols	TOE (TCP/IP)
Other network protocols supported	iSCSI Boot
PS/2 ports quantity	0
USB 2.0 ports quantity	5
Bundled software	Symantec Backup ExecTM 12.5 Symantec Backup ExecTM System Recovery 8.5 CommVault 7.0 Vizioncore
Compatible operating systems	Microsoft Windows Server 2008, Microsoft Windows Server 2003 Red Hat Linux Enterprise SUSE Linux Enterprise Server 10 x86-64 VMware ESX 3.5
Chassis type	Rack (2U)
Storage temperature (T-T)	-40 - 65 °C
Operating temperature (T-T)	10 - 35 °C
Storage relative humidity (H-H)	-40 - 65 %
Operating relative humidity (H-H)	20 - 80 %
Certification	FCC (U.S. only) Class A ICES (Canada) Class B CE Mark (EN 55022 Class B, EN55024, EN61000-3-2, EN61000-3-3) VCCI (Japan) Class B BSMI (Taiwan) Class A C-Tick (Australia/New Zealand) Class B SABS (South Africa) Class B CCC (China) Class B MIC (Korea) Class B UL 60950 CAN/CSA C22.2 No. 60950 EN 60950 IEC 60950
Processor ARK ID	33079

Weight and Dimensions

Depth	744 mm
Width	444.3 mm
Height	86.4 mm
Weight	23000 g