Dell PowerEdge R510 User Manual

Installing System Components 119
Installing Memory Modules
WARNING: The memory modules are hot to the touch for some time after the
system has been powered down. Allow time for the memory modules to cool
before handling them. Handle the memory modules by the card edges and avoid
touching the components on the memory module.
CAUTION: Many repairs may only be done by a certified service technician.
You should only perform troubleshooting and simple repairs as authorized in
your product documentation, or as directed by the online or telephone service and
support team. Damage due to servicing that is not authorized by Dell is not
covered by your warranty. Read and follow the safety instructions that came
with the product.
1 Turn off the system, including any attached peripherals, and disconnect
the system from the electrical outlet.
2 Open the system. See "Opening the System" on page 87.
3 Remove the cooling shroud. See "Removing the Cooling Shroud" on
page 90.
4 Locate the memory module sockets. See Figure 6-1.
5 Press the ejectors on the memory module socket down and out, as shown
in Figure 3-19, to allow the memory module to be inserted into the socket.
6 Handle each memory module only on either card edge, making sure not to
touch the middle of the memory module.
Mirroring 1-GB XX 2142
2-GB XX 4284
Table 3-2. Sample UDIMM Memory Configurations (Per Processor)
Memory
Mode
Memory
Module
Size
Memory
Sockets
Single Processor Dual Processor
4 1 2 3 Physical
Memory
(GB)
Available
Memory
(GB)
Physical
Memory
(GB)
Available
Memory
(GB)
book.book Page 119 Friday, November 20, 2009 2:56 PM

Dell PowerEdge R510 Specifications

General

HDD size	3.5 \
Hot-swap	Yes
HDD capacity	450 GB
HDD interface	Serial Attached SCSI (SAS)
Total storage capacity	900 GB
Number of HDDs installed	2
Number of HDDs supported	8
Internal memory	4 GB
Memory clock speed	1066 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	64 GB
Tcase	76 °C
Bus type	QPI
Stepping	D0
FSB Parity	No
Processor code	SLBF6
Processor cache	8 MB
Processor cores	4
Processor model	E5540
System bus rate	5.86 GT/s
Processor series	Intel Xeon 5500 Series
Processor socket	Socket B (LGA 1366)
Processor codename	Nehalem EP
Motherboard chipset	Intel® 5500
Processing Die size	263 mm²
Processor frequency	2.53 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor system type	DP
Processor manufacturer	Intel
Processor package size	42.5 x 45 mm
Processor front side bus	- MHz
Processor boost frequency	2.8 GHz
Processor operating modes	64-bit
Thermal Design Power (TDP)	80 W
CPU multiplier (bus/core ratio)	19
Number of Processing Die Transistors	731 M
Memory channels supported by processor	Triple
Memory clock speeds supported by processor	800, 1066 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	144 GB
PS/2 ports quantity	0
Serial ports quantity	1
USB 2.0 ports quantity	6
Display	LCD
L1 cache	0.064 MB
Form factor	-
Graphics card	G200eW
Dimensions (WxDxH)	86.4 x 436.6 x 609.6 mm
Compatible operating systems	Microsoft Windows Small Business Server 2008/2003/ Novell SUSE Linux Enterprise Server 11/10 SP2 Linux Red Hat Enterprise 5.3/4.7 VMware vSphere Version 4.0 VMware ESX v3.5 / ESXi v3.5
Power consumption (typical)	1100 W
Noise level	42 dB
Chassis type	Rack (2U)
PCI Express x4 slots	3
Processor ARK ID	37104
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Weight	13500 g