Dell PowerEdge R910 - Default Chapter; Table of Contents

Dell PowerEdge R910 Technical Guide iii
Table of Contents
1 Product Comparison ........................................................................................... 6
1.1 Overview .................................................................................................. 6
1.2 Purpose-Built for Reliability ............................................................................ 6
1.3 Efficient Infrastructure .................................................................................. 6
1.4 Intelligent Platforms, Connected Foundations ....................................................... 6
1.5 Comparison ............................................................................................... 7
2 Key Technologies ............................................................................................... 8
2.1 Overview .................................................................................................. 8
2.2 Intel Processors Feature Set ............................................................................ 8
2.3 Memory Controller ....................................................................................... 9
2.4 Internal Dual SD Module (IDSM) ........................................................................ 9
2.5 10Gb Embedded NIC ..................................................................................... 9
3 System Information .......................................................................................... 10
4 Mechanical .................................................................................................... 13
4.1 Chassis Description..................................................................................... 13
4.2 Dimensions and Weight ................................................................................ 13
4.3 Front Panel View and Features ...................................................................... 14
4.4 Back Panel View and Features ....................................................................... 15
4.5 Power Supply Indicators ............................................................................... 15
4.6 NIC Indicators ........................................................................................... 15
4.7 Rails and Cable Management ......................................................................... 16
4.8 Fans ...................................................................................................... 16
4.9 Security .................................................................................................. 16
4.9.1 Cover Latch ....................................................................................... 16
4.9.2 Bezel ............................................................................................... 16
4.9.3 Hard Drive ......................................................................................... 16
4.9.4 Trusted Platform Module (TPM) ................................................................ 16
4.9.5 Power Off Security ............................................................................... 17
4.9.6 Intrusion Alert .................................................................................... 17
4.9.7 Secure Mode ...................................................................................... 17
4.10 USB Key .................................................................................................. 17
4.11 Battery ................................................................................................... 17
4.12 Field Replaceable Units (FRU)........................................................................ 17
4.13 User Accessible Jumpers, Sockets, and Connectors ............................................... 17
5 Power, Thermal, Acoustic .................................................................................. 18
5.1 Power Supplies and Power Subsystem .............................................................. 18
5.2 Environmental Specifications......................................................................... 20
5.3 Thermal.................................................................................................. 21
5.4 Acoustics ................................................................................................ 21
6 Processors ..................................................................................................... 24
6.1 Overview ................................................................................................ 24
6.2 Features ................................................................................................. 24
6.3 Supported Processors .................................................................................. 25
6.4 Processor Configurations .............................................................................. 25
6.5 Additional Processor Information .................................................................... 26
7 Memory ........................................................................................................ 27
7.1 Overview ................................................................................................ 27
7.2 Slots and Risers ......................................................................................... 27
7.3 Key Features of the Memory Subsystem ............................................................ 27
7.4 Memory Speed Limitations ............................................................................ 28