■ Remove all packaging materials from the device.
■ Do not place the device in a hot, wet or very humid environment.
■ Place the device on a level, horizontal surface so that it is stable.
■ The socket must be easily accessible so that the power supply can
be disconnected quickly in case of an emergency.
■ Before you connect the device, compare the connection data for
the device (voltage and frequency) on the type plate with that of
your mains power supply. This data must match to avoid damage
to the device.
■ Keep the connection cable away from hot surfaces and sharp
edges.
■ Do not to bend the connection cable or pull it too tightly.
■ Do not allow the connection cable to hang over corners, as per-
sons may trip and fall.
■ Always wait for a lamination process to nish before starting the
next.
Press the on/off switch
3
to switch on the device.
The device automatically heats to the correct temperature for la-
minating lms with a thickness of 80
µm. The ready lamp (2) turns
green as soon as the device is ready.
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