Hi-Link HLK-RM60 - Technical Specifications

User Manual
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Technical specifications
Module
Model Number HLK-RM60
Package In-line
Wireless
parameters
Wireless standard
IEEE 802.11 a/b/g/n/ac/ax
Frequency Range
2.4G Wi-Fi: 2412-2462MHz ;
5G Wi-Fi: 5150-5250MHz, 5725-5850MHz
Transmit power
802.11b: +18.99dBm
802.11g: +18.65dBm, 802.11a: +16.80dBm
802.11n20: +23.69dBm, 802.11ac20: +19.64dBm
802.11n40: +21.48dBm, 802.11ac40:+20.00dBm
802.11ax20: +19.56dBm , 802.11ax40: +20.29dBm
802.11ac80: +21.31dBm, 802.11ax80: +21.38dBm
Receiving sensitivity
802.11b: -88.4 dBm (@11Mbps ,CCK)
802.11g: -75.7dBm (@54Mbps, OFDM)
802.11n: -73.6dBm (@HT20, MCS7)
802.11a: -75.0 dBm (@MCS7)
802.11ac: -75.0 dBm (@MCS9)
802.11ax: -73.0 dBm (@MCS11)
Antenna Type
External ：4*I-PEX Connector
Hardware
parameters
Hardware interface
UART，IIC，PWM，GPIO, SPI
Network port
5*Full Gigabit Ethernet port
USB
1*USB3.0+1*USB2.0
Work Voltage
3.3V
GPIO Drive capability
Max：12ma
Work Current
Keep sending=>average：~800mA,Max: 1000mA
In normal mode=>average：~750mA,Max: 800mA
Temperature
Operating temperature : -20℃~ +60℃
Storage temperature: ‐40℃~ +85℃
Size
90*60mm
Software
parameters
Wireless network type
STA/AP
Firmware Upgrade
Web Upgrade
Network protocol
IPv4, TCP/UDP
User configuration
Web configuration
Table 1. Technical specifications