RELIABILITY TEST
DATA
1.
INTRODUCTION
Microcomputers provide high reliability and quality
to
meet
the
demands
of
increased functions, enlarging scale,
and
wid-
ening application. Hitachi has improved the quality level
of
microcomputer products by evaluating reliability, building
quality into the manufacturing process, strengthening inspection
techniques, and analyzing field data.
The following reliability and quality assurance
data
for
Hitachi 8-bit single-chip microcomputers indicates results from
test and failure analysis.
(1) Plastic DIP
Bonding wire
2.
PACKAGE
AND
CHIP STRUCTURE
2.1 Packaging
Production
output
and
application
of
plastic packaging con-
tinues
to
increase, expanding
to
automobile measuring
and
con-
trol systems, and computer terminal equipment operating under
severe conditions. To meet this demand, Hitachi has significantly
improved moisture resistance
and
operational stability in the
plastic manufacturing process.
Plastic and side-brazed ceramic package structures are shown
in Figure I and Table I.
(2) Plastic
Flat
Package
Figure 1
Package
Structure
Table 1 Package Material and Properties
Item Plastic DIP
Plastic Flat Package
Package
Epoxy Epoxy
Lead Solder dipping Alloy
42
Solder plating Alloy 42
Die
bond
Au·Si
or
Ag
paste
Au·Si
or
Ag
paste
Wire bond
Thermo
compression
Thermo
compression
Wire
Au
Au
25
To Next Page
Loading...
