HP 14s - Page 54

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Thermal paste is used on the processor (1) and associated heat sink area (2).
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the heat sink is removed. Replacement thermal material
is included with the heat sink, processor, and system board spare part kits.
5. UMA graphics models with 6 W Intel Pentium and Celeron processors: In the order indicated on the
heat sink, remove the four longer screws (1) and three shorter screws (2) that secure the heat sink to
the system board.
6. Remove the heat sink from the system board (3).
46 Chapter 5 Removal and replacement procedures for Authorized Service Provider parts