b. Remove the heat sink (2) from the system board.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Replacement thermal material is included with the
heat sink, processor, and system board spare part kits.
The following illustrations show the replacement thermal material locations.
●
Discrete graphics with fan: Thermal paste is used on the processor (1) and associated heat sink area
(2), as well as the graphics chip (3) and associated heat sink area (4).
Component replacement procedures 59
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