d. Memory module service cover (see Memory module on page 40)
e. Optical drive (see
Optical drive on page 42)
f. Keyboard (see
Keyboard on page 47)
g. Top cover (see
Top cover on page 50)
h. Fan (see
Fan on page 57)
i. System board (see
System board on page 61)
Remove the heat sink:
1. Turn the system board upside down, with the front toward you.
2. Models are available with either UMA or discrete graphics. The heat sink on discrete models
includes two additional screws. Refer to the following steps that match your model:
Discrete models:
a. Following the 1, 2, 3, 4, 5, 6 sequence stamped into the heat sink, loosen the six Phillips
PM2.0×4.5 screws (1) that secure the heat sink to the system board.
b. Remove the heat sink (2).
NOTE: Due to the adhesive quality of the thermal material located between the heat sink
and the system board components, it may be necessary to move the heat sink from side to
side to detach it.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat
sink and the system board components each time the heat sink is removed. Replacement
thermal material is included with the heat sink, processor, and system board spare part kits.
NOTE: For discrete models, thoroughly clean thermal material from the surfaces of the system
board components each time you remove the heat sink. Thermal paste is used on the processor
(1) and the heat sink section (2) that services it. A thermal pad is used on the Northbridge chip
(3) and the heat sink section (4) that services it. All heat sink and processor spare part kits
include thermal material.
66 Chapter 6 Removal and replacement procedures for Authorized Service Provider parts
To Next Page
Loading...
