HP 8110A - Page 18

Procedure ...............
5-34
Test, 6.2: Width Jitter .......... 5-38
Test Specifications ............
5-38
Equipment. Needed ...........
5-38
Procedure
...............
5-38
Test, 6.3: Delay Jitter ..........
5-42
Test Specifications ............
5-42
Equipmenl, Needed ...........
5-42
Procedure ...............
5-42
Test. 7: High and Low Levels ........
5-45
Test Specifications ............
6-45
Equipment. Needed ...........
6-45
Procedure
...............
5-46
‘l&t 7.1: High Level, 50 Ohms into 50
Ohms
................
5-47
Test 7.2:~,Low Level, 50 Ohms into 50
Ohms
................
5-49
‘l&t 7.3: High Level, 1K Ohms into 50
Ohms
................
5-51
Test 7.4: Low Level, IK Ohms into 50
Ohms
................
5-53
Test 8: Transition Time ..........
5-55
Test, Specifications ............
5-55
Equipment. Needed ...........
5-55
Procedure ...............
5-66
Test 8.la: Leading Edge Test .......
,556
Test 8. lb: Trailing Edge Test .......
5-69
Test 8.2x Min. Leading edge for Level
Window >f5V ...........
5-61
Test, 8.2b: MinTrailing edge for Level
Window kt5v ............
5-63
Test, 9: Pulse Aberration Test .......
5-64
Test SpecificaGons ............
5-64
Equipment Needed ...........
5-64
Procedure
...............
5-64
Overshoot, and Ringing .........
5-66
Preshoot 5-66
HP 8110A Performance Test Records ....
6-68
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