Service Model
8903B
HP
5020-8160
11
I
1'
UNGAR PL-111
4-
4
MODIFIED
',
?
ASSHOWN
SOLDER
TIP,
0.127
(0.050)
+
I\
a
\
'
-'
0.3180-
(0.1250)
DIMENSIONS IN
CM
(IN.)
Figitrc
8-2.
Hcal-Sluking
Tip
8-1
5.
Other Service Documents
Service Notes, Manual Updates, and other service literature are available through Hewlett-Packard. For further
information, contact your nearest Hewlett-Packard office.
8-1
5.1
Component Replacement Procedures
The A2A1 Options
010,
011,
012, 013
,015,
A2A2 Options 050. 051, 052.
053,
055, A3, A4, A5, A6, A7. A9,
A10,
All,
A12 and A13 printed circuit board assemblies are manufactured using
a
Hot Air Leveled (HAL)
process. The printed circuit board traces, pads and plated-through holes (PTH) are copper. While the process
has several advantages over conventional processes the printed circuit boards are more susceptible
to
broken
traces, lifted pads and damage
to
the plated-through holes. Therefore, additional care must be taken when
replacing components on HAL printed circuit boards.
Listed below are soldering considerations that apply to all printed circuit boards:
0
The temperature of the soldering iron tip and the tip is
in
contact with the printed circuit board.
0
The size and shape of the soldering iron tip.
0
The pressure of the soldering iron tip
on
the pad.
0
The operator's skill.
When replacing components on HAL printed circuit boards the following steps should also be taken.
1.
Use
a
temperature controlled soldering iron set at a temperntiire of
600°F
(315°C).
Extensive tests were made by Hewlett-Packard using commercial brands of soldering irons.
As
n
result
of these tests, the recommended soldering iron was the L-IEXACON THERM-0-TRAC
STATION
#IO00
with the FLNGER GRLP SLEEVE
21
A-5 and solder tip
#J
301X. During soldering, the tip temperature
of the
HEXACON
THERM-0-TRAC STATION remained very stable.
2.
Cut
out
the body of the component to
be
removed. (Leave leads as long
as
possible for easier removal.)
3.
Apply heat to the lead only, add solder as required, slide tip down to the pad and remove solder with
solder sucker.
8-4
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