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HP Apollo 4200 Gen10

HP Apollo 4200 Gen10
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MF877-00 Page 2
Template Revision A
HPE instructions for this template are available at MF877-01
Item Description
Notes
Quantity
of items
included
in product
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torx Driver
T10
Torx Driver
T15
Philps Driver
#2
Flat head screw driver
Medium
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. System Battery - Remove the top cover and locate the standup card in back pci card slot bay next to the chassis wall.
Remove the board by pulling the front CPU drawer out ~ 3 inches then unscrewing the PCA's two blue finger screws
located on both ends of the PCA. Use a medium flat head screwdriver or fingers to remove the battery and dispose of
properly.
2. Megacell - Some models, remove the battery from the holder and disconnect cable from PCA.
3. Capacitors=>2.5CM - Remove the power supplies from the system. With a #2 Philips screw driver, remove the screws
securing the top cover, then locate the capacitors and pry from the PCB with a medium flat head screw driver and
dispose of properly.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Attachment 1, 2 System Coin Battery location
Attachment 3 Megacell location
Attachment 4 to 8 - Capacitor location by model number of supply

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