HP Apollo 4200 Gen10 User Manual

MF877-00 Page 1
Template Revision A
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Servers
Marketing Name / Model
[List multiple models if applicable.]
HPE Apollo 4200 Gen10
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU
directive 2012/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
1.3 Quantities vary by product configuration.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
6
Batteries
All types including standard alkaline and lithium
coin or button style batteries
2
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
Quantity varies by product configuration and power
supply model selected
1 to 10
External electrical cables and cords
Quantity depends on number of power supplies,
networking devices, and I/O devices
1 to 15
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0

HP Apollo 4200 Gen10 Specifications

General

Processor	Intel Xeon Scalable processors
Processor Sockets	2
Memory Slots	24 DIMM slots
Form Factor	2U rack
Memory	Up to 3 TB (24 x 128 GB DDR4 DIMMs at 2666 MT/s)
Network	FlexibleLOM
Operating System Support	Windows Server, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware
RAID Support	HPE Smart Array controllers

Summary

Items Requiring Selective Treatment

Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)

Circuit boards with a surface greater than 10 sq cm require selective treatment.

Batteries

All types of batteries, including coin or button styles, require selective treatment.

Mercury-containing components

Components containing mercury, such as lamps and display backlights, need selective treatment.

Liquid Crystal Displays (LCD)

LCDs with a surface greater than 100 sq cm, including gas discharge lamps, require selective treatment.

Cathode Ray Tubes (CRT)

CRT displays require selective treatment.

Capacitors / condensers (Containing PCB/PCT)

Electrolytic capacitors/condensers larger than 2.5 cm require selective treatment.

External electrical cables and cords

Cables and cords require selective treatment based on device dependency.

Gas Discharge Lamps

Gas discharge lamps require selective treatment.

Plastics containing Brominated Flame Retardants

Plastics with brominated flame retardants require selective treatment.

Components and parts containing toner and ink

Items with toner/ink, including liquids or gels, require selective treatment.

Components and waste containing asbestos

Components or waste containing asbestos require selective treatment.

Components, parts and materials containing refractory ceramic fibers

Materials containing refractory ceramic fibers require selective treatment.

Tools Required

Product Disassembly Process

Optional Graphic

Optional graphic illustration to identify items requiring selective treatment and their locations.