HP Compaq 2710p Maintenance And Service Guide

Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure
determine the degree of sensitivity. Networks built into many integrated circuits provide some protection,
but in many cases, ESD contains enough power to alter device parameters or melt silicon junctions.
A discharge of static electricity from a finger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.
An electronic device exposed to ESD may not be affected at all and can work perfectly throughout a
normal cycle. Or the device may function normally for a while, then degrade in the internal layers,
reducing its life expectancy.
CAUTION: To prevent damage to the computer when you are removing or installing internal
components, observe these precautions:
Keep components in their electrostatic-safe containers until you area ready to install them.
Use nonmagnetic tools.
Before touching an electronic component, discharge static electricity by using the guidelines described in
this section.
Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
The following table shows how humidity affects the electrostatic voltage levels generated by different
activities.
CAUTION: A product can be degraded by as little as 700 V.
Typical electrostatic voltage levels
Relative humidity
Event 10% 40% 55%
Walking across carpet 35,000 V 15,000 V 7,500 V
Walking across vinyl floor 12,000 V 5,000 V 3,000 V
Motions of bench worker 6,000 V 800 V 400 V
Removing DIPS from plastic tube 2,000 V 700 V 400 V
Removing DIPS from vinyl tray 11,500 V 4,000 V 2,000 V
Removing DIPS from Styrofoam 14,500 V 5,000 V 3,500 V
Removing bubble pack from PCB 26,500 V 20,000 V 7,000 V
Packing PCBs in foam-lined box 21,000 V 11,000 V 5,000 V
32 Chapter 4 Removal and replacement procedures

HP Compaq 2710p Specifications

General

Tjunction	100 °C
FSB Parity	No
Processor cache	2 MB
Processor cores	2
System bus rate	- GT/s
Processor family	Intel® Core™2 Duo
Processor socket	LGA 3647 (Socket P)
Processor codename	Merom
Processing Die size	143 mm²
Processor frequency	1.33 GHz
Processor cache type	L2
Processor lithography	65 nm
Processor manufacturer	Intel
Processor front side bus	533 MHz
Processor operating modes	64-bit
Thermal Design Power (TDP)	10 W
Number of Processing Die Transistors	291 M
HDD speed	4200 RPM
Optical drive type	DVD Super Multi
Total storage capacity	120 GB
Display diagonal	12.1 \
Display resolution	1280 x 800 pixels
Native aspect ratio	16:10
Internal memory	2 GB
Memory clock speed	667 MHz
Internal memory type	DDR2-SDRAM
Discrete graphics card	Yes
Discrete graphics card model	Intel® GMA X3100
Maximum graphics card memory	0.384 GB
Type	PC
Modem speed	56 Kbit/s
Dimensions (WxDxH)	290 x 212 x 28.2 mm
Wireless technology	802.11a/b/g/draft-n, a/b/g, b/g
Bluetooth version	2.0+EDR
Operating system installed	Windows Vista Business
Number of battery cells	6
Serial ports quantity	0
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Processor ARK ID	33920
Processor package size	35 x 35 mm
Country of origin	China

Weight and Dimensions

Depth	290 mm
Width	212 mm
Height	28.2 mm
Weight	1650 g