HP Compaq 6730s User Manual

Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure
determine the degree of sensitivity. Networks built into many integrated circuits provide some protection,
but in many cases, ESD contains enough power to alter device parameters or melt silicon junctions.
A discharge of static electricity from a finger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.
An electronic device exposed to ESD may not be affected at all and can work perfectly throughout a
normal cycle. Or the device may function normally for a while, then degrade in the internal layers,
reducing its life expectancy.
CAUTION: To prevent damage to the computer when you are removing or installing internal
components, observe these precautions:
Keep components in their electrostatic-safe containers until you area ready to install them.
Use nonmagnetic tools.
Before touching an electronic component, discharge static electricity by using the guidelines described
in this section.
Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
The following table shows how humidity affects the electrostatic voltage levels generated by different
activities.
CAUTION: A product can be degraded by as little as 700 V.
Typical electrostatic voltage levels
Relative humidity
Event 10% 40% 55%
Walking across carpet 35,000 V 15,000 V 7,500 V
Walking across vinyl floor 12,000 V 5,000 V 3,000 V
Motions of bench worker 6,000 V 800 V 400 V
Removing DIPS from plastic tube 2,000 V 700 V 400 V
Removing DIPS from vinyl tray 11,500 V 4,000 V 2,000 V
Removing DIPS from Styrofoam 14,500 V 5,000 V 3,500 V
Removing bubble pack from PCB 26,500 V 20,000 V 7,000 V
Packing PCBs in foam-lined box 21,000 V 11,000 V 5,000 V
44 Chapter 4 Removal and replacement procedures

HP Compaq 6730s Specifications

General

Bus type	FSB
Stepping	M0
Tjunction	100 °C
Processor cache	1 MB
Processor cores	2
System bus rate	- GT/s
Processor family	Intel Pentium Mobile
Processor series	Intel Pentium T3000 Series for Mobile
Processor socket	Socket 478
Processor codename	Merom
Processing Die size	143 mm²
Processor frequency	2.16 GHz
Processor cache type	L2
Processor lithography	65 nm
Processor manufacturer	Intel
Processor front side bus	667 MHz
Processor operating modes	64-bit
ECC supported by processor	No
Thermal Design Power (TDP)	35 W
CPU multiplier (bus/core ratio)	13
Number of Processing Die Transistors	291 M
Motherboard chipset	Intel® PM45 Express
HDD speed	5400 RPM
HDD interface	SATA
Optical drive type	DVD Super Multi DL
Card reader integrated	Yes
Total storage capacity	250 GB
Display surface	Matt
Display diagonal	15.4 \
Display resolution	1280 x 800 pixels
Native aspect ratio	16:10
Type	PC
Modem speed	56 Kbit/s
Wireless technology	802.11a/b/g/n
Memory slots	2x SO-DIMM
Internal memory	2 GB
Memory clock speed	800 MHz
Internal memory type	DDR2-SDRAM
Maximum internal memory	4 GB
Audio system	HD Audio
Bluetooth version	2.0+EDR
Networking features	Fast Ethernet, WLAN
Operating system installed	FreeDOS
Number of battery cells	6
Charging port type	DC-in jack
Serial ports quantity	0
USB 2.0 ports quantity	4
Storage temperature (T-T)	-20 - 60 °C
Operating temperature (T-T)	0 - 35 °C
Operating relative humidity (H-H)	10 - 90 %
Non-operating relative humidity (non-condensing)	5 - 95 %
AC adapter power	65 W
Pointing device	Touchpad + Scroll zone
Discrete graphics card model	Intel® GMA X4500HD
Processor code	SLB3P
Processor ARK ID	35583
Country of origin	China

Weight and Dimensions

Depth	266 mm
Width	358 mm
Weight	2500 g
Height (front)	32 mm