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HP Compaq 6730s User Manual

HP Compaq 6730s
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Packaging and transporting guidelines
Follow these grounding guidelines when packaging and transporting equipment:
To avoid hand contact, transport products in static-safe tubes, bags, or boxes.
Protect ESD-sensitive parts and assemblies with conductive or approved containers or packaging.
Keep ESD-sensitive parts in their containers until the parts arrive at static-free workstations.
Place items on a grounded surface before removing items from their containers.
Always be properly grounded when touching a component or assembly.
Store reusable ESD-sensitive parts from assemblies in protective packaging or nonconductive
foam.
Use transporters and conveyors made of antistatic belts and roller bushings. Be sure that
mechanized equipment used for moving materials is wired to ground and that proper materials are
selected to avoid static charging. When grounding is not possible, use an ionizer to dissipate
electric charges.
Workstation guidelines
Follow these grounding workstation guidelines:
Cover the workstation with approved static-shielding material.
Use a wrist strap connected to a properly grounded work surface and use properly grounded tools
and equipment.
Use conductive field service tools, such as cutters, screwdrivers, and vacuums.
When fixtures must directly contact dissipative surfaces, use fixtures made only of static-safe
materials.
Keep the work area free of nonconductive materials, such as ordinary plastic assembly aids and
Styrofoam.
Handle ESD-sensitive components, parts, and assemblies by the case or PCM laminate. Handle
these items only at static-free workstations.
Avoid contact with pins, leads, or circuitry.
Turn off power and input signals before inserting or removing connectors or test equipment.
Preliminary replacement requirements 45

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HP Compaq 6730s Specifications

General IconGeneral
Bus typeFSB
SteppingM0
Tjunction100 °C
Processor cache1 MB
Processor cores2
System bus rate- GT/s
Processor familyIntel Pentium Mobile
Processor seriesIntel Pentium T3000 Series for Mobile
Processor socketSocket 478
Processor codenameMerom
Processing Die size143 mm²
Processor frequency2.16 GHz
Processor cache typeL2
Processor lithography65 nm
Processor manufacturerIntel
Processor front side bus667 MHz
Processor operating modes64-bit
ECC supported by processorNo
Thermal Design Power (TDP)35 W
CPU multiplier (bus/core ratio)13
Number of Processing Die Transistors291 M
Motherboard chipsetIntel® PM45 Express
HDD speed5400 RPM
HDD interfaceSATA
Optical drive typeDVD Super Multi DL
Card reader integratedYes
Total storage capacity250 GB
Display surfaceMatt
Display diagonal15.4 \
Display resolution1280 x 800 pixels
Native aspect ratio16:10
TypePC
Modem speed56 Kbit/s
Wireless technology802.11a/b/g/n
Memory slots2x SO-DIMM
Internal memory2 GB
Memory clock speed800 MHz
Internal memory typeDDR2-SDRAM
Maximum internal memory4 GB
Audio systemHD Audio
Bluetooth version2.0+EDR
Networking featuresFast Ethernet, WLAN
Operating system installedFreeDOS
Number of battery cells6
Charging port typeDC-in jack
Serial ports quantity0
USB 2.0 ports quantity4
Storage temperature (T-T)-20 - 60 °C
Operating temperature (T-T)0 - 35 °C
Operating relative humidity (H-H)10 - 90 %
Non-operating relative humidity (non-condensing)5 - 95 %
AC adapter power65 W
Pointing deviceTouchpad + Scroll zone
Discrete graphics card modelIntel® GMA X4500HD
Processor codeSLB3P
Processor ARK ID35583
Country of originChina
Weight and Dimensions IconWeight and Dimensions
Depth266 mm
Width358 mm
Weight2500 g
Height (front)32 mm

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