Substrate
family
Warm-up
drying
temperatur
e offset
Warm-up
curing
temperatur
e
Warm-up
curing
temperatur
e offset
Cool-down
drying
temperatur
e
Cool-down
drying
temperatur
e offset
Cool-down
curing
temperatur
e
Cool-down
curing
temperatur
e offset
Minimum
drying
power
Textile 58508009000.7
Film 585080010000.7
Synthetic
paper
5800750850 0
Paper-
aqueous
5600750850 0
Paper-
solvent
107507509000.7
Low-temp.10800750850 0
Mesh 108508008500.7
The various settings mentioned above are described below.
Setting Description If too low If too high
Warm-up drying
temperature
The base temperature that the
substrate in the print zone must
reach before printing starts.
This setting is determined by the RIP. You cannot change it.
Warm-up drying
temperature offset
This offset is added to the base
warm-up drying temperature, and
the total is displayed in the front
panel while the printer is
preparing to print.
Bleeding or coalescence may
appear in the first 200-300 mm of
the print.
A longer time to start printing is
required. Vertical banding or ink
smears may occur.
Warm-up curing
temperature
The base temperature that the
substrate in the curing zone must
reach before printing starts.
This setting is determined by the printer. You cannot change it.
Warm-up curing
temperature offset
This offset is added to the base
warm-up curing temperature, and
the total is displayed in the front
panel while the printer is
preparing to print.
The beginning of the print is not
fully dry, or looks oily.
Substrate degradation (blisters,
adhesive detachment) at the
beginning of the print.
Cool-down drying
temperature
The base temperature at which
the substrate can be under the
drying module without being
damaged. At the end of a job, the
substrate is not stopped until this
temperature is reached.
This setting is determined by the printer. You cannot change it.
Cool-down drying
temperature offset
This offset is added to the base
cool-down drying temperature.
A long time is needed to finish the
print.
The substrate at the beginning of
the next print may be damaged,
because it has stopped moving
under too high a temperature. This
case is uncommon.
Cool-down curing
temperature
The base temperature at which
the substrate can be under the
curing module without being
damaged. At the end of a job, the
substrate is not stopped until this
temperature is reached.
This setting is determined by the printer. You cannot change it.
46 Chapter 5 Substrate settings ENWW
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