Setting Description If too low If too high
Cool-down curing
temperature offset
This offset is added to the base
cool-down curing temperature.
A long time is needed to finish the
print.
The end of the print may be
damaged if the cutter is disabled.
Minimum drying
power
The minimum power applied in the
drying module while printing, so
the substrate does not cool too
much in lightly inked areas.
A heavily inked area that comes
after a lightly inked area will have
bleeding or coalescence defects.
The substrate is damaged in blank
or lightly inked areas of the print,
especially with a high number of
passes.
Temperature profile
Many of the main and advanced substrate settings are related to temperature control, since this is a critical
area for correct printing results with latex inks on a wide variety of substrates. The diagram below
graphically represents the evolution of drying and curing temperatures during the various printing phases.
NOTE: Target temperatures and time are not to scale. For the specific values used for a given substrate
type (family), consult the main and advanced settings tables above.
NOTE: t
p
time can be modified through the printer’s front panel.
Select the number of passes
Increasing the number of passes will tend to improve the print quality but reduce the speed of printing.
Passes Uni/bidir Self
adhesive
Banner Textile Film Syntheti
c paper
Paper
aqueous
Paper
solvent
Low
temp.
Mesh
4 Bidir No No No No No No No No No
6 Bidir Maybe Start
here
No No No Start
here
Maybe Maybe No
8 Bidir Start
here
Yes No No No Yes Start
here
Start
here
Start
here
ENWW Add a new substrate 47
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