HP Elite Dragonfly - User Manual

EL-MF877-00 Page 1
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP Elite Dragonfly Notebook PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the
disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the
plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description
Notes
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
1
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button style
batteries
1
Li-Ion batteries. Include all Li-Ion batteries if more than
one is provided with the product (such as a detachable
notebook keyboard battery, RTC coin cell, etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[X] screws
[ ] snaps
[ ] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater than
100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring greater
than 2.5 cm in diameter or height
0
External electrical cables and cords
DC Cable for External Power Supply
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
0

HP Elite Dragonfly Specifications

General

Form factor	Convertible (Folder)
Product type	Hybrid (2-in-1)
Product color	Black
Country of origin	China
Intel® vPro™ Platform Eligibility	No
RGB color space	NTSC
Display diagonal	13.3 \
Touch technology	Multi-touch
Anti-glare screen	Always gives an optimal view, even in direct sunlight.
Display brightness	400 cd/m²
Native aspect ratio	16:9
NTSC coverage (typical)	72 %
Display bezel technology	Micro-Edge
Display diagonal (metric)	33.8 cm
Memory slots	1x SO-DIMM
Internal memory	16 GB
Memory clock speed	2133 MHz
Memory form factor	SO-DIMM
Internal memory type	LPDDR3-SDRAM
Maximum internal memory	- GB
On-board graphics card ID	0x3EA0
Discrete graphics card model	Not available
On-board graphics card model	Intel® UHD Graphics
Maximum on-board graphics card memory	32 GB
On-board graphics card OpenGL version	4.5
On-board graphics card base frequency	300 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1100 MHz
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
SSD interface	PCI Express, NVMe
Storage media	SSD
Total storage capacity	512 GB
Number of SSDs installed	1
MIMO type	Multi User MIMO
Antenna type	2x2
Bluetooth version	5.0
Top Wi-Fi standard	Wi-Fi 6 (802.11ax)
WLAN controller model	Intel Wi-Fi 6 AX200
WLAN controller manufacturer	Intel
HDMI version	1.4
USB 2.0 ports quantity	0
Thunderbolt 3 ports quantity	2
Pointing device	Clickpad
Keyboard special features	Morsbestendig
Operating system architecture	64-bit
AC adapter power	65 W
Battery weight	220 g
Battery capacity	38 Wh
Sustainability certificates	ENERGY STAR
HP segment	Business
HP speaker type	HP Quad Speakers
HP Management tools	HP Driver Packs; HP System Software Manager (SSM); HP BIOS Config Utility (BCU); HP Client Catalog; HP Manageability Integration Kit Gen3
Bus type	OPI
Tjunction	100 °C
Processor cache	6 MB
Processor model	i5-8265U
System bus rate	4 GT/s
Processor family	Intel® Core™ i5
Processor socket	BGA 1528
Processor threads	8
Processor codename	Whiskey Lake
Configurable TDP-up	25 W
Processor frequency	1.6 GHz
Processor cache type	L3
Configurable TDP-down	10 W
Processor lithography	14 nm
PCI Express slots version	3.0
Processor boost frequency	3.9 GHz
PCI Express configurations	1x4, 2x2
Thermal Design Power (TDP)	15 W
Configurable TDP-up frequency	1.8 GHz
Configurable TDP-down frequency	0.8 GHz
Maximum number of PCI Express lanes	16
Processor ARK ID	149088
Processor package size	46x24 mm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Intel Identity Protection Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00
Package depth	402 mm
Package width	137 mm
Package height	315 mm
Harmonized System (HS) code	84713000

Weight and Dimensions

Depth	197.5 mm
Width	304.3 mm
Height	16.1 mm
Weight	990 g

Summary

Product End-of-Life Disassembly Instructions

Items Requiring Selective Treatment

Lists components requiring special handling during disassembly.

Tools Required

Lists essential tools needed for product disassembly.

Product Disassembly Process

Outlines the general steps for disassembling the product.