NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly and system board each time the fan/heat sink assembly is removed. Thermal paste is
located on the processor/Northbridge component (1) and the fan/heat sink assembly section that
services it (2). A thermal pad is used on the graphics subsystem conponent (3) and the fan/heat sink
assembly section that services it (4). Replacement thermal material is included with all fan/heat sink
assembly and system board spare part kits.
Reverse this procedure to install the fan/heat sink assembly.
100 Chapter 4 Removal and replacement procedures ENWW
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