HP EliteBook 2740p Maintenance And Service Guide

Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure
determine the degree of sensitivity. Networks built into many integrated circuits provide some
protection, but in many cases, ESD contains enough power to alter device parameters or melt
silicon junctions.
A discharge of static electricity from a finger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.
An electronic device exposed to ESD may not be affected at all and can work perfectly throughout a
normal cycle. Or the device may function normally for a while, and then degrade in the internal layers,
reducing its life expectancy.
CAUTION: To prevent damage to the computer when you are removing or installing internal
components, observe these precautions:
Keep components in their electrostatic-safe containers until you are ready to install them.
Use nonmagnetic tools.
Before touching an electronic component, discharge static electricity by using the guidelines
described in this section.
Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
The following table shows how humidity affects the electrostatic voltage levels generated by different
activities.
CAUTION: A product can be degraded by as little as 700 V.
Typical electrostatic voltage levels
Relative humidity
Event 10% 40% 55%
Walking across carpet 35,000 V 15,000 V 7,500 V
Walking across vinyl floor 12,000 V 5,000 V 3,000 V
Motions of bench worker 6,000 V 800 V 400 V
Removing DIPS from plastic tube 2,000 V 700 V 400 V
Removing DIPS from vinyl tray 11,500 V 4,000 V 2,000 V
Removing DIPS from Styrofoam 14,500 V 5,000 V 3,500 V
Removing bubble pack from PCB 26,500 V 20,000 V 7,000 V
Packing PCBs in foam-lined box 21,000 V 11,000 V 5,000 V
ENWW Preliminary replacement requirements 33

HP EliteBook 2740p Specifications

General

Bus type	DMI
Stepping	C2
Tjunction	105 °C
Processor cache	3 MB
Processor cores	2
System bus rate	2.5 GT/s
Processor family	Intel® Core™ i5
Processor series	Intel Core i5-500 Mobile Series
Processor socket	BGA 956
Processor threads	4
Processor codename	Arrandale
Processing Die size	81 mm²
Processor frequency	2.53 GHz
Processor cache type	Smart Cache
Processor technology	Intel Centrino 2 w/ vPro
Processor lithography	32 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor boost frequency	3.07 GHz
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16
Thermal Design Power (TDP)	35 W
CPU multiplier (bus/core ratio)	19
Maximum number of PCI Express lanes	16
Number of Processing Die Transistors	382 M
Display	-
Modem speed	56 Kbit/s
Battery type	HP Long Life 6-cell (39 WHr) Lithium-Ion Primary Battery
Graphics card	HD Graphics
Internal modem	Yes
Expansion slots	1 Express Card/34; 1 Smart Card Reader; 1 secure digital/MultiMedia card
Video card note	Microsoft DirectX 10 (Shader 4.0) and OpenGL 2.1 capable, with DDR3 system memory
Dimensions (WxDxH)	290 x 212 x 31.7 mm
Power requirements	External 65W Smart AC adapter; Power cord (1.8 meters, with AC adapter 3.66 meters); HP Fast Charge
HDD controller type	Solid State Drive SATA II (5400 rpm)
Wireless technology	Intel 802.11a/b/g; HP Integrated Module with Bluetooth 2.1 Wireless Technology
Maximum HDD capacity	320 GB
Intel segment tagging	Enterprise
Minimum storage drive space	160 GB
Compatible operating systems	Genuine Windows Vista Enterprise 32; Genuine Windows Vista Enterprise 64; Genuine Windows 7 Home Premium; SuSE Linux Enterprise 10
Main camera resolution (numeric)	2 MP
Bluetooth version	2.1+EDR
Networking features	Integrated Intel 82577 Gigabit Ethernet (10/100/1000 NIC)
Operating temperature (T-T)	5 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %
Memory slots	2x SO-DIMM
Memory upgrade	8 GB
Internal memory	4 GB
Memory clock speed	1333 MHz
HDD capacity	0 GB
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
Display diagonal	12.1 \
Display resolution	1280 x 800 pixels
Native aspect ratio	16:10
Audio system	HD
Audio included	High Definition Audio support with 24-bit DAC, Integrated stereo speakers, Integrated dual-microphone array, Touch-sensitive controls for volume up, volume down, and mute, Combo headphone/mic jack
Motherboard chipset	Intel® QM57 Express
I/O ports	3 USB 2.0; 1 1394a; 1 AC power; 1 combo stereo headphone/mic jack; 1 docking connector; 1 RJ-11; 1 RJ-45; 1 secondary battery connector; 1 VGA-in
Charging port type	DC-in jack
USB 2.0 ports quantity	3
Firewire (IEEE 1394) ports	1
Number of battery cells	6
Trial software	WinZip 12; Microsoft Office Professional 2007; HP SkyRoom
Bundled software	HP Recovery Manager; HP Support Assistant; HP QuickLaunch Buttons; HP QuickLook 3; HP QuickWeb; HP DayStarter; HP Power Assistant; HP Connection Manager; HP Wireless Assistant
Operating system installed	Windows 7 Professional
Form factor	Convertible (Swivel)
Product type	Hybrid (2-in-1)
Country of origin	China
Storage drive type	160 GB Solid State Drive SATA II Hard Drive 160, 250 or 320 GB (5400 rpm), Solid State Drive 80 or 160 GB, HP 3D DriveGuard
Keyboard type	HP spill-resistant keyboard, HP Night Light shines directly on the keyboard for low-light conditions
Keyboard layout	QWERTY
Processor ARK ID	43544
Processor package size	rPGA 37.5x 37.5, BGA 34x28 mm
Graphics & IMC lithography	45 nm
Supported instruction sets	SSE4.1/4.2
Intel® Turbo Boost Technology	1.0
Physical Address Extension (PAE)	36 bit
On-board graphics card model	Intel® HD Graphics
On-board graphics card base frequency	500 MHz
On-board graphics card dynamic frequency (max)	766 MHz

Weight and Dimensions

Depth	212 mm
Width	290 mm
Height	31.7 mm
Weight	1720 g