2. Following the 1, 2, 3, 4 sequence stamped into the heat sink, loosen the four captive Philllips screws (1)
– (4) that secure the heat sink to the system board, and then remove the heat sink (5).
NOTE: Due to the adhesive quality of the thermal material located between the heat sink and
the system board components, it may be necessary to move the heat sink from side to side to detach it.
3. The following illustrations show the replacement thermal material locations. The thermal material
must be thoroughly cleaned from the surfaces of the heat sink and the system board components each
time the heat sink is removed. Replacement thermal material is included with the heat sink, processor,
and system board spare part kits.
a. Discrete models:
Thermal paste is used on the system board components (1) and (3) and on the heat sink areas (2)
and (4) that services them.
84 Chapter 6 Removal and replacement procedures for Authorized Service Provider parts
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