HP EliteBook 8570p User Manual

d.
WWAN module (see
WWAN module on page 92)
e. WLAN module (see
WLAN module on page 94)
f.
Fan (see
Fan on page 100)
g. Keyboard (see
Keyboard on page 101)
h. Base enclosure (see
Base enclosure on page 107)
i. System board (see
System board on page 121)
Remove the heat sink:
1. Turn the system board upside down, with the front toward you.
NOTE: Step 2 applies to computer models equipped with a graphics subsystem with discrete
memory. See step 3 for heat sink removal information for computer models equipped with a
graphics subsystem with UMA memory.
2. Following the 1, 2, 3, 4, 5, 6, 7 sequence stamped into the heat sink, loosen the seven captive
Philllips screws (1) and (2) that secure the heat sink to the system board, and then remove
the heat sink (3).
NOTE: Due to the adhesive quality of the thermal material located between the heat sink and
the system board components, it may be necessary to move the heat sink from side to side to
detach it.
3. Following the 1, 2, 3, 4 sequence stamped into the heat sink, loosen the four captive Philllips
screws (1) that secure the heat sink to the system board, and then remove the heat sink (2).
NOTE: Due to the adhesive quality of the thermal material located between the heat sink and
the system board components, it may be necessary to move the heat sink from side to side to
detach it.
128 Chapter 4 Removal and replacement procedures

HP EliteBook 8570p Specifications

General

Bus type	DMI
Stepping	L1
Tjunction	105 °C
Processor cache	3 MB
Processor cores	2
Processor model	i5-3230M
System bus rate	5 GT/s
Processor family	Intel® Core™ i5
Processor series	Intel Core i5-3200 Mobile series
Processor socket	BGA 1023
Processor threads	4
Processor codename	Ivy Bridge
Processor frequency	2.6 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor boost frequency	3.2 GHz
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	35 W
CPU multiplier (bus/core ratio)	26
Maximum number of PCI Express lanes	16
Motherboard chipset	Intel® QM77 Express
Internal memory	4 GB
Memory clock speed	1600 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	- GB
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Card reader integrated	Yes
Total storage capacity	500 GB
Number of HDDs installed	1
Display diagonal	15.6 \
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
On-board graphics card ID	0x166
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 4000
On-board graphics card family	Intel® HD Graphics
On-board graphics card base frequency	650 MHz
On-board graphics card dynamic frequency (max)	1100 MHz
LightScribe	-
Intel segment tagging	Enterprise
Audio system	SRS PS PRO
WWAN	Not installed
Data network	Not supported
Wi-Fi standards	802.11a, 802.11b, 802.11g
Bluetooth version	4.0
Cabling technology	10/100/1000Base-T(X)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Charging port type	DC-in jack
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
eSATA/USB 3.2 Gen 1 (3.1 Gen 1) ports quantity	0
Pointing device	Touchpad
Operating system installed	Windows 8 Pro
Form factor	Clamshell
Product type	Laptop
Product color	Silver
Country of origin	China
Processor code	SR0WX
Processor ARK ID	72056
Processor package size	31 x 24 (BGA1023) mm
Supported instruction sets	AVX
Intel Identity Protection Technology version	1.00
Battery capacity	62 Wh
Battery life (max)	8.25 h
Number of battery cells	6
AC adapter power	65 W
AC adapter frequency	50 - 60 Hz
AC adapter input voltage	100 - 240 V
Sustainability certificates	EPEAT Gold, ENERGY STAR

Weight and Dimensions

Depth	251 mm
Width	374 mm
Height	34 mm
Weight	2610 g