3.
Remove the fan/heat sink assembly (3).
NOTE: Due to the adhesive quality of the thermal material located between the fan/heat sink
assembly and the system board components, it may be necessary to move the fan/heat sink
assembly from side to side to detach it.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly and the processor each time the fan/heat sink assembly is removed. Replacement thermal
material is included with the fan/heat sink assembly and system board spare part kits. Thermal paste is
used on the processor (1) and the section of the fan/heat sink assembly (2) that services it.
Reverse this procedure to install the fan/heat sink assembly.
56 Chapter 4 Removal and replacement procedures
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