Worldwide — Version 1.1 — February, 2014 Page 19
802.11n:-69 dBm (150 Mbps), -66 dBm (300 Mbps)
2 U.FL type connectors (output impedance of 50 ± 2 ohms)
Width 17 x Depth 10.5 x High 1.5(mm)
3.3v +/- 9% and 1.8V +/- 9%
14° to 158° F (-10° to 70° C)
-40° to 176° F (-40° to 80° C)
10% to 90% (non-condensing)
5% to 95% (non-condensing)
0 to 10,000 ft (3,048 m)
0 to 50,000 ft (15,240 m)
HP Integrated Module with Bluetooth 4.0 LE SDIO Wireless Technology*
*This module is Bluetooth Smart Ready for systems running Windows 8 and Windows 8.1.
Width 17 x Depth 10.5 x High 1.5(mm)
Number of Available
Channels
79 (1 MHz) available channels
Data Rates and
Throughput
3 Mbps data rate; throughput up to 2.17 Mbps
Synchronous Connection Oriented links up to 3, 64 kbps, voice channels
Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric
or 1306.9 kbps symmetric
-1.5 dBm to 4 dBm (Bluetooth Class II)
Better than -20 dBM at 0.1 % raw bit error rate
Peak (Tx) 300 mW
Peak (Rx) 180 mW
Selective Suspend 10 mW
Internally integrated within module
Microsoft Windows Plug and Play compliant
Bluetooth Software
Supported
Broadcom Bluetooth for Windows
Microsoft Windows Bluetooth Software
Point to Point, Multipoint Pico Nets up to 7 slaves
Full support of Bluetooth Security Provisions
Microsoft Windows ACPI, and USB Bus Support
Self-configurable to optimize power conservation in all operating modes,
including Standby, Hold, Park, and Sniff
All necessary regulatory approvals for supported countries, including:
FCC (47 CFR) Part 15C, Section 15.247 & 15.249
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