HP PAVILION DM3 Maintenance And Service Guide

4. Remove the fan/heat sink assembly (7) by lifting straight up.
Reverse this procedure to install the fan/heat sink assembly.
The thermal material must be thoroughly cleaned from the surface of the fan/heat sink assembly (1),
(3) and the processor (2) and video components (4) each time the fan/heat sink assembly is
removed. Thermal pads and thermal paste must be installed on all surfaces before the fan/heat sink
assembly is reinstalled.
NOTE: Thermal pads and thermal paste are included with all fan/heat sink assembly, system board,
and processor spare part kits.
The following illustration shows the locations for thermal material on systems with UMA graphics
subsystems.
The thermal material must be thoroughly cleaned from the surface of the fan/heat sink assembly (1)
and (3), and the processor component (2), each time the fan/heat sink assembly is removed. Thermal
Component replacement procedures 71

HP PAVILION DM3 Specifications

General

Screen Size	13.3 inches
Graphics	Intel GMA 4500MHD
Storage	320GB HDD
Operating System	Windows 7 Home Premium
Weight	1.9 kg
Ports	3 x USB 2.0, HDMI, VGA, Ethernet, Headphone/Microphone combo jack
Battery	6-cell Lithium-Ion
Processor	Intel Core 2 Duo SU7300
RAM	4GB DDR3
Memory	DDR3
Resolution	1366 x 768
Wireless	802.11b/g/n
CPU	Intel Core 2 Duo