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HP PAVILION G6 User Manual

HP PAVILION G6
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Remove the fan and heat sink:
1. Turn the system board upside down, with the front toward you.
2. Disconnect the fan cable (1) from the system board.
CAUTION: To prevent damage to heat sinks and/or processors, loosen/tighten captive screws
in sequence as numerically labeled.
NOTE: The heat sink and fan appearance and the number of screws may be different from the
heat sink and fan pictured.
3. Loosen the four Phillips captive screws (2) and the three Phillips captive screws (3) that secure
the heat sink to the system board.
4. Remove the fan and heat sink (4).
NOTE: Due to the adhesive quality of the thermal material located between the heat sink and
system board components, it may be necessary to move the heat sink from side to side to
detach it.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the heat sink is removed. Replacement thermal material is
included with the base enclosure, heat sink, processor, and system board spare part kits.
Thermal paste is used on the processor (1) and the heat sink section (2) that services it
A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that
services it (only on computer models equipped with a graphics subsystem with
discrete memory)
ENWW
Component replacement procedures
81

Table of Contents

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HP PAVILION G6 Specifications

General IconGeneral
Processor cache2 MB
Processor cores4
Processor modelP960
Processor familyAMD Phenom II
Processor socketSocket S1
Processor frequency1.8 GHz
Processor cache typeL2
Processor manufacturerAMD
Number of processors supported1
Motherboard chipset-
Internal memory4 GB
Internal memory typeDDR3-SDRAM
Memory layout (slots x size)1 x 4 GB
TypePC
Power supply typeAC/DC
Infrared data portNo
Number of speakers2
AC adapter includedYes
Ethernet interface typeFast Ethernet
Number of products included1 pc(s)
HDD speed5400 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi DL
Total storage capacity500 GB
Compatible memory cardsMMC, SD
Display diagonal15.6 \
Display resolution1366 x 768 pixels
Native aspect ratio16:9
Display diagonal (metric)39.6 cm
Discrete graphics card modelAMD Radeon HD 6470M
On-board graphics card modelNot available
Discrete graphics memory typeGDDR3
Speakers manufacturerAltec Lansing
Wi-Fi standards802.11b, 802.11g, Wi-Fi 4 (802.11n)
Cabling technology10/100Base-T(X)
Networking featuresFast Ethernet, WLAN
Ethernet LAN data rates10, 100 Mbit/s
Charging port typeDC-in jack
Headphone connectivity3.5 mm
USB 2.0 ports quantity3
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity0
Pointing deviceTouchpad
Operating system installedWindows 7 Home Basic
Operating system architecture64-bit
Form factorClamshell
Product colorGray
Country of originChina
Battery life (max)- h
Number of battery cells6
AC adapter power90 W
Weight and Dimensions IconWeight and Dimensions
Depth245 mm
Width374 mm
Height30.5 mm
Weight2550 g

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