HP Pavilion m6 User Manual

NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the heat sink is removed. Replacement thermal material is
included with the heat sink, processor, and system board spare part kits.
The following illustration shows the replacement thermal material locations on a computer model
equipped with a graphics subsystem with discrete memory.
●
Thermal paste is used on the processor (1) and the heat sink section (2) that services it
●
Thermal paste is used on the graphics subsystem chip (3) and the heat sink section (4) that
services it
The following illustration shows the replacement thermal material locations on a computer model
equipped with a graphics subsystem with discrete memory. Thermal paste is used on the processor
(1) and the heat sink section (2) that services it.
Component replacement procedures
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HP Pavilion m6 Specifications

General

Processor	Intel Core i7
RAM	Up to 8GB DDR3
Storage	Up to 1TB HDD or SSD options
Display	15.6-inch HD or Full HD
Graphics	Intel HD Graphics 4000, AMD Radeon HD 7670M
Operating System	Windows 8
Battery	6-cell Lithium-Ion battery
Wireless	802.11b/g/n, Bluetooth
Audio	Beats Audio
Webcam	HD webcam
Ports	USB 3.0, USB 2.0, HDMI, VGA, Ethernet, headphone/microphone combo jack, multi-format card reader