HP ProBook 6450b Specification

QuickSpecs
HP ProBook 6450b Notebook PC
HP Pr
oBook 6550b Notebook PC
Technical Specifications
DA
–
13616
E
MEA
—
Version
1
—
M
ay
, 2010
Page
22
automatic shutdown
Connector
3 pin/grounded, mates with interchangeable cords
Environmental
Design
Operating temperature 0° to 40° C (32° to 104° F)
Non
-
operating (storage)
temperature
-
20° to 65° C
(
-
4° to 149° F
)
Altitude 0 to 3,048 m (0 to 10,000 ft)
Humidity 20% to 80%
Storage Humidity
10% to 90%
EMI and Safety
Certifications
CE Mark
-
full compliance with LVD and EMC directives; Worldwide
safety standards - IEC60950, EN60950, UL60950, Class1, SELV;
Agency approvals - C-UL-US, NORDICS, DENAN, EN55022 Class B,
FCC Class B, CISPR22 Class B, CCC, NOM-1 NYCE; MTBF- over
200,000 hours at 25°C ambient condition.
HP 65W Smart AC
Adapter
Dimensions
10.6 x 4.7 x 2.8 cm
(
4.17 x 1.85 x 1.1 in
)
Weight
280 g
(
0.62 l
b
)
Input
100 to 240 VAC
Input Efficiency
87% min at 115 VAC
Input frequency range
47 to 63 Hz
Input AC current
1.7 A at 90 VAC, 0.85 A at 180 VAC
Output
Output power
65W
DC output 18.5V
Hold-up time 5 msec at 115 VAC input
Output current limit <11A, Over voltage protection- 29V max
automatic shutdown
Connector
3 pin/grounded, mates with interchangeable cords
Environmental
Design
Operating temperature
0° to 40° C
(
32° to 104° F
)
Non
-
operating (storage)
temperature
-
20° to 65° C
(
-
4° to 149° F
)
Altitude
0 to 3,048 m
(
0 to 10,000 ft
)
Humidity
20% to 80%
Storage Humidity
10% to 90%
EMI and Safety
Certifications
CE Mark - full compliance with LVD and EMC directives; Worldwide
safety standards - IEC60950, EN60950, UL60950, Class1, SELV;
Agency approvals - C-UL-US, NORDICS, DENAN, EN55022 Class B,
FCC Class B, CISPR22 Class B, CCC, NOM-1 NYCE; MTBF - over
200,000 hours at 25°C ambient condition.
Optional HP Ultra
-
Capacity Battery
Dimensions
(H x W x
L)
3.33 x 15.25 x 26.88 cm
(
1.
3 x 6.0 x 10.6 in
)
Weight
0.803 kg (1.77 lb)

HP ProBook 6450b Specifications

General

Bus type	DMI
Stepping	C2
Tjunction	105 °C
Processor cache	2 MB
Processor cores	2
System bus rate	2.5 GT/s
Processor family	Intel® Core™ i5
Processor series	Intel Core i5-500 Mobile Series
Processor socket	BGA 956
Processor threads	4
Processor codename	Arrandale
Processing Die size	81 mm²
Processor frequency	2.4 GHz
Processor cache type	L2
Processor lithography	32 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor boost frequency	2.93 GHz
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16
Thermal Design Power (TDP)	35 W
CPU multiplier (bus/core ratio)	18
Maximum number of PCI Express lanes	16
Number of Processing Die Transistors	382 M
Motherboard chipset	Intel® HM57 Express
HDD speed	7200 RPM
HDD interface	SATA II
Optical drive type	DVD Super Multi DL
Card reader integrated	Yes
Total storage capacity	250 GB
Number of HDDs installed	1
Display diagonal	14 \
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
Power supply type	AC/DC
Intel segment tagging	Enterprise
Operating temperature (T-T)	41 - 95 °F
Compliance industry standards	IEEE802.3, IEEE802.3u, IEEE802.3ab
Memory slots	2x SO-DIMM
Internal memory	2 GB
Memory clock speed	1333 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	8 GB
Pointing device	Touchpad
Wi-Fi standards	802.11a, 802.11b, 802.11g
Bluetooth version	2.1+EDR
Cabling technology	10/100/1000Base-T(X)
Networking features	Gigabit Ethernet
Operating system installed	Windows 7 Professional
Operating system architecture	32-bit
ExpressCard slot	-
Charging port type	DC-in jack
USB 2.0 ports quantity	3
CardBus PCMCIA slots quantity	0
AC adapter power	65 W
Battery capacity	55 Wh
Number of battery cells	6
Storage relative humidity (H-H)	5 - 95 %
Product color	Black, Silver
Country of origin	China
Discrete graphics card model	Intel® HD Graphics
On-board graphics card base frequency	500 MHz
On-board graphics card dynamic frequency (max)	766 MHz
Processor ARK ID	47341
Processor package size	rPGA 37.5x 37.5, BGA 34x28 mm
Graphics & IMC lithography	45 nm
Supported instruction sets	SSE4.1/4.2
Intel® Turbo Boost Technology	1.0
Physical Address Extension (PAE)	36 bit

Weight and Dimensions

Depth	236.2 mm
Width	339 mm
Height	33.8 mm
Weight	2260 g