HP ProBook 6450b Specification

QuickSpecs
HP ProBook 6450b Notebook PC
HP Pr
oBook 6550b Notebook PC
Technical Specifications
DA
–
13616
E
MEA
—
Version
1
—
M
ay
, 2010
Page
30
HP Fingerprint
Sensor (optional)
Mobile Voltage
Operation
3.0V
-
3.6V Single Supply
Operating
Temperature
32° - 158°F (0° - 70°C)
Current Consumption
@ 3.3V
Less than 70 mA peak imaging and scrolling
Less than 25 mA hardware finger detection
Advanced Power Management
High
-
Rate Image
Capture
Up to 240 image frames /sec
ESD Resistance
IEC 61000-4-2 Level 4 (±15KV)
Detection Matrix
192 x 16 Pixels
9.7 mm x 0.81 mm
500 ppi High-Resolution Images
Communications
Integrate
d Intel
Gigabit Network
Connection
(10/100/1000 NIC)
82577LM
[codename Hanksville-M
for internal use only]
Ethernet Features
10 Mbit/s operation (10BASE
-
T; IEEE 802.3i; IEEE 802.3 clauses 13
-
14)
100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses
21-30)
1000 Mbit/s operation (1000BASE-T; IEEE 802.3z and 802.3ab;
IEEE 802.3 clauses 34-42)
Auto-Negotiation (Automatic Speed Selection)
Full Duplex Operation at all Speeds, Half Duplex operation at 10 and
100 Mbit/s
IEEE 802.1p QoS (Quality of Service) Support
IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable)
Power Management
ACPI compliant
--
multiple power modes
Situation-sensitive features reduce power consumption
Performance
Features
TCP/IP/UDP Checksum Offload (configurabl
e)
Manageability
Wake
-
on
-
LAN from standby and hibernation (Magic Packet and
Microsoft Wake-Up Frame); Wake-on-LAN from off (Magic Packet
only)
PXE 2.1 Remote Boot
Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB
(802.3x, clause 30))
Comprehensive diagnostic and configuration software suite
Intel Advanced Management Technology 6.0 (iAMT)
Interface
PCI Express x1
based, SMBUS dedicated connection with Intel® 5
Series Chipset
NIC Device Driver
Name
Intel 82577 Gigabit Network Connection

HP ProBook 6450b Specifications

General

Bus type	DMI
Stepping	C2
Tjunction	105 °C
Processor cache	2 MB
Processor cores	2
System bus rate	2.5 GT/s
Processor family	Intel® Core™ i5
Processor series	Intel Core i5-500 Mobile Series
Processor socket	BGA 956
Processor threads	4
Processor codename	Arrandale
Processing Die size	81 mm²
Processor frequency	2.4 GHz
Processor cache type	L2
Processor lithography	32 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor boost frequency	2.93 GHz
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16
Thermal Design Power (TDP)	35 W
CPU multiplier (bus/core ratio)	18
Maximum number of PCI Express lanes	16
Number of Processing Die Transistors	382 M
Motherboard chipset	Intel® HM57 Express
HDD speed	7200 RPM
HDD interface	SATA II
Optical drive type	DVD Super Multi DL
Card reader integrated	Yes
Total storage capacity	250 GB
Number of HDDs installed	1
Display diagonal	14 \
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
Power supply type	AC/DC
Intel segment tagging	Enterprise
Operating temperature (T-T)	41 - 95 °F
Compliance industry standards	IEEE802.3, IEEE802.3u, IEEE802.3ab
Memory slots	2x SO-DIMM
Internal memory	2 GB
Memory clock speed	1333 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	8 GB
Pointing device	Touchpad
Wi-Fi standards	802.11a, 802.11b, 802.11g
Bluetooth version	2.1+EDR
Cabling technology	10/100/1000Base-T(X)
Networking features	Gigabit Ethernet
Operating system installed	Windows 7 Professional
Operating system architecture	32-bit
ExpressCard slot	-
Charging port type	DC-in jack
USB 2.0 ports quantity	3
CardBus PCMCIA slots quantity	0
AC adapter power	65 W
Battery capacity	55 Wh
Number of battery cells	6
Storage relative humidity (H-H)	5 - 95 %
Product color	Black, Silver
Country of origin	China
Discrete graphics card model	Intel® HD Graphics
On-board graphics card base frequency	500 MHz
On-board graphics card dynamic frequency (max)	766 MHz
Processor ARK ID	47341
Processor package size	rPGA 37.5x 37.5, BGA 34x28 mm
Graphics & IMC lithography	45 nm
Supported instruction sets	SSE4.1/4.2
Intel® Turbo Boost Technology	1.0
Physical Address Extension (PAE)	36 bit

Weight and Dimensions

Depth	236.2 mm
Width	339 mm
Height	33.8 mm
Weight	2260 g