HP ProBook 6450b Specification

QuickSpecs
HP ProBook 6450b Notebook PC
HP Pr
oBook 6550b Notebook PC
Technical Specifications
DA
–
13616
E
MEA
—
Version
1
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M
ay
, 2010
Page
39
Broadcom 4313GN
802.11b/g/n
WiFi Adapter
Wireless LAN
Standards
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
Interoperability
Wi
-
Fi certified
Cisco Compatible Extensions Program compliant with Microsoft Win7,
Vista and XP (details at:
http://w
ww.hp.com/go/notebooks/WLAN
)
Frequency Band
2.4 GHz
Data Rates
802.11b: 1, 2, 5.5, 11 Mbps
802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n: 6.5, 7.2, 13, 14.4, 19.5, 21.7, 26, 28.9, 39, 43.3, 52,
57.8, 58.5, 65, 72.2Mbps
Frequency Support
20 MHz:
2.4 GHz bands
Modulation
Direct Sequence Spread Spectrum
DBPSK, DQPSK, CCK, OFDM, BPSK, QPSK, 16-QAM, 64-QAM
Security
1
Supports 64
-
and 128
-
bit WEP, WPA, WPA2, hardware
-
accelerated
AES, 802.1x authentication types EAP-TLS, EAP-TTLS, PEAP-GTC, PEAP-
MSCHAPv2, LEAP, EAP-FAST.
Support for Cisco Security Features (proven compatibility with Cisco
Aironet infrastructure products through the Cisco Compatible Extensions
Program Version 4) with Microsoft Windows Vista and XP only.
Sub
-
channels
Multinational
support with frequency bands and channels compliant to
local regulations.
Media Access
Protocol
CSMA/CA (Collision Avoidance) with ACK
Network
Architecture
Models
Ad
-
hoc (Peer to Peer)
Infrastructure (Access Point Required)
Roaming
IEEE 802.11 comp
liant roaming between access points
Output Power (for
CCK)
2
17 dBm , nominal
Output Power
(for
OFDM; power varies by
data rate)
2
15 dBm , nominal
Power Consumption
Idle associated: 250 mW avg (CLKREQ enabled)
Idle unassociated: 425 mW avg
Transmit/Re
ceive 20 MHz channel: 5.5 W (max)
Power Management
ACPI compliant power management
802.11 compliant power saving mode
Receiver Sensitivity
3
72.2 Mbps:
-
71dBm
Antenna type
High efficiency dual band antenna with spatial diversity, usually
mounted in t
he display enclosure
Form Factor
PCI
-
Express Half
-
MiniCard

HP ProBook 6450b Specifications

General

Bus type	DMI
Stepping	C2
Tjunction	105 °C
Processor cache	2 MB
Processor cores	2
System bus rate	2.5 GT/s
Processor family	Intel® Core™ i5
Processor series	Intel Core i5-500 Mobile Series
Processor socket	BGA 956
Processor threads	4
Processor codename	Arrandale
Processing Die size	81 mm²
Processor frequency	2.4 GHz
Processor cache type	L2
Processor lithography	32 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor boost frequency	2.93 GHz
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16
Thermal Design Power (TDP)	35 W
CPU multiplier (bus/core ratio)	18
Maximum number of PCI Express lanes	16
Number of Processing Die Transistors	382 M
Motherboard chipset	Intel® HM57 Express
HDD speed	7200 RPM
HDD interface	SATA II
Optical drive type	DVD Super Multi DL
Card reader integrated	Yes
Total storage capacity	250 GB
Number of HDDs installed	1
Display diagonal	14 \
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
Power supply type	AC/DC
Intel segment tagging	Enterprise
Operating temperature (T-T)	41 - 95 °F
Compliance industry standards	IEEE802.3, IEEE802.3u, IEEE802.3ab
Memory slots	2x SO-DIMM
Internal memory	2 GB
Memory clock speed	1333 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	8 GB
Pointing device	Touchpad
Wi-Fi standards	802.11a, 802.11b, 802.11g
Bluetooth version	2.1+EDR
Cabling technology	10/100/1000Base-T(X)
Networking features	Gigabit Ethernet
Operating system installed	Windows 7 Professional
Operating system architecture	32-bit
ExpressCard slot	-
Charging port type	DC-in jack
USB 2.0 ports quantity	3
CardBus PCMCIA slots quantity	0
AC adapter power	65 W
Battery capacity	55 Wh
Number of battery cells	6
Storage relative humidity (H-H)	5 - 95 %
Product color	Black, Silver
Country of origin	China
Discrete graphics card model	Intel® HD Graphics
On-board graphics card base frequency	500 MHz
On-board graphics card dynamic frequency (max)	766 MHz
Processor ARK ID	47341
Processor package size	rPGA 37.5x 37.5, BGA 34x28 mm
Graphics & IMC lithography	45 nm
Supported instruction sets	SSE4.1/4.2
Intel® Turbo Boost Technology	1.0
Physical Address Extension (PAE)	36 bit

Weight and Dimensions

Depth	236.2 mm
Width	339 mm
Height	33.8 mm
Weight	2260 g