HP ProDesk 600 G4 SFF Business User Manual

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Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP ProDesk 600 G4 SFF Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
7
Batteries
All types including standard alkaline and lithium coin
or button style batteries RTC
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0

HP ProDesk 600 G4 SFF Business Specifications

General

Form Factor	Small Form Factor (SFF)
Chipset	Intel Q370
RAM	Up to 64GB DDR4 2666MHz
Storage	Up to 2TB HDD or 512GB SSD
Graphics	Intel UHD Graphics 630
Operating System	Windows 10 Pro
Networking	Intel I219-LM Gigabit Ethernet
Ports (Front)	1x USB 3.1 Gen 1; 1x USB 3.1 Type-C Gen 2; 1x Headphone/Microphone Combo
Ports (Rear)	2x USB 2.0, 2x USB 3.1 Gen 1, 1x VGA, 1x RJ-45
Expansion Slots	1x PCIe x16, 1x M.2
Power Supply	180W external
Dimensions	3.7 inches
Weight	13.2 lbs (6.0 kg)

Summary

Items Requiring Selective Treatment

Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)

With a surface greater than 10 sq cm.

Batteries

All types including standard alkaline and lithium coin or button style batteries RTC.

Mercury-containing components

For example, mercury in lamps, display backlights, scanner lamps, switches, batteries.

Liquid Crystal Displays (LCD)

With surface greater than 100 sq cm, includes gas discharge lamps.

Cathode Ray Tubes (CRT)

No specific description provided.

Capacitors / condensers

Containing PCB/PCT or measuring greater than 2.5 cm in diameter or height.

External electrical cables and cords

No specific description provided.

Gas Discharge Lamps

No specific description provided.

Plastics containing Brominated Flame Retardants

Weighing > 25 grams, not including PCBs or PCAs.

Components and parts containing toner and ink

Including liquids, semi-liquids (gel/paste) and toner.

Components and waste containing asbestos

No specific description provided.

Components, parts and materials containing refractory ceramic fibers

No specific description provided.

Components, parts and materials containing radioactive substances

No specific description provided.

Tools Required

Star screwdriver

OD 3.3mm.

Cross screwdriver

OD 3.0mm.

Cross screwdriver (larger)

OD 6.0mm.

Hexagon socket wrench

4.6mm.

Product Disassembly Process

Remove Side Panel

Push thumb latch on the chassis rear side and pick up the side panel.

Remove Front Bezel

Release 4 bezel latches by pulling outwards and pick up the bezel.

Unplug ODD & HDD Cables

Unplug the Optical Disk Drive and Hard Disk Drive cables as shown.

Remove Drive Cage

Press HDD cage, push button, rotate cage, pass cables, then remove cage.

Remove FIO Cage

Pick up FIO bracket from chassis as shown.

Remove ODD & HDD

Push HDD latch, push HDD, release screws, then pull ODD.

Release All Cables

Release all internal cables from their connectors and mounts.

Remove Fan Duct

Push fan duct latch and pick up fan duct from chassis.

Remove Cooler

Release 4 screws from cooler and unplug the cable.

Remove CPU

Unlock CPU socket latch, open cover, then pick up CPU.

Remove Memory

Press memory slot levers outward and pull up memory.

Remove WLAN Module

Release WLAN card screw and pull up WLAN card from MB.

Remove SSD Module

Release SSD card screw and pull up SSD card from MB.

Remove PCIEXP Cards

Open slot lock cover and pull up all PCIEXP cards.

Remove 2nd Serial Card

Unplug cable, release two screws, then release 2nd serial card.

Remove Option Card

Release two screws, then pull up option card.

Remove Card Reader

Release one screw, then pull up card reader.

Remove Antenna Cable

Release front antenna screw, press rear latch, release rear screw, pull cable.

Remove Motherboard (MB)

Release betty and 8 screws, then pick up MB to release from chassis.

Remove PSU

Release 4 screws, push PSU latch, pull PSU from chassis.

Remove Speaker

Release one screw, then pick up speaker from chassis.