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HP ProLiant BL460c

HP ProLiant BL460c
108 pages
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Contents 3
Contents
Component identification............................................................................................................... 6
Front panel components ............................................................................................................................. 6
Front panel LEDs ....................................................................................................................................... 7
SAS and SATA hard drive LEDs................................................................................................................... 8
SAS and SATA hard drive LED combinations ................................................................................................ 8
System board components.......................................................................................................................... 9
Mezzanine connector definitions ..................................................................................................... 10
DIMM slot locations ....................................................................................................................... 10
System maintenance switch............................................................................................................. 10
HP c-Class Blade SUV Cable..................................................................................................................... 11
Operations................................................................................................................................. 12
Power up the server blade........................................................................................................................ 12
Power down the server blade.................................................................................................................... 12
Remove the server blade .......................................................................................................................... 13
Remove the access panel.......................................................................................................................... 14
Install the access panel............................................................................................................................. 14
Remove the DIMM baffle.......................................................................................................................... 14
Setup......................................................................................................................................... 15
Overview ............................................................................................................................................... 15
Installing an HP BladeSystem c-Class enclosure ........................................................................................... 15
Installing server blade options................................................................................................................... 15
Installing interconnect modules.................................................................................................................. 15
Interconnect bay numbering and device mapping.............................................................................. 16
Connecting to the network........................................................................................................................ 18
Installing a server blade ........................................................................................................................... 18
Hardware options installation....................................................................................................... 21
Introduction ............................................................................................................................................ 21
Hard drive option.................................................................................................................................... 21
Processor option...................................................................................................................................... 22
Memory options...................................................................................................................................... 27
Memory subsystem architecture ....................................................................................................... 27
Single-, dual-, and quad-rank DIMMs ............................................................................................... 28
DIMM identification....................................................................................................................... 28
Memory configurations................................................................................................................... 29
General DIMM slot population guidelines.........................................................................................30
Installing a DIMM.......................................................................................................................... 33
Mezzanine card option............................................................................................................................ 34
Cache module and battery pack option...................................................................................................... 35
HP Trusted Platform Module option ............................................................................................................ 39
Installing the Trusted Platform Module board ..................................................................................... 40
Retaining the recovery key/password .............................................................................................. 43
Enabling the Trusted Platform Module............................................................................................... 43
Cabling ..................................................................................................................................... 45

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