HP ProLiant DL560 Gen 9 User Manual

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Product End-of-Life Disassembly Instructions
Product Category: Servers
Marketing Name / Model
[List multiple models if applicable.]
HP ProLiant DL560 Gen 9
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
5
Batteries
All types including standard alkaline and lithium
coin or button style batteries
2
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
Mother Board have 2pcs Electrolytic Coapacitors
greater than 2.5 cm and others depend on Power
Supply Model
6
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0

HP ProLiant DL560 Gen 9 Specifications

General

Product Type	Server
Processor	Intel Xeon E5-4600 v3 product family
Memory	Up to 3TB DDR4
Storage	SFF SAS/SATA/SSD
Network	4 x 1Gb Ethernet ports (embedded)
Management	HP iLO 4
Operating System Support	Windows Server, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware

Summary

Items Requiring Selective Treatment

Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)

Components with a surface area greater than 10 sq cm requiring selective treatment.

Batteries

All battery types, including alkaline and lithium coin/button styles.

Mercury-Containing Components

Items like lamps, display backlights, scanner lamps, and switches containing mercury.

Liquid Crystal Displays (LCD)

LCDs with a surface greater than 100 sq cm, including gas discharge lamp displays.

Cathode Ray Tubes (CRT)

Components classified as Cathode Ray Tubes.

Capacitors / Condensers (Containing PCB/PCT)

Capacitors or condensers containing PCB or PCT.

Electrolytic Capacitors / Condensers

Capacitors exceeding 2.5 cm in diameter or height.

External Electrical Cables and Cords

Electrical cables and cords used externally.

Gas Discharge Lamps

Lamps that operate by gas discharge.

Plastics with Brominated Flame Retardants

Plastics weighing over 25 grams containing brominated flame retardants.

Components with Toner and Ink

Parts containing toner, ink, liquids, semi-liquids, gel, or paste.

Components with Asbestos

Components and waste materials containing asbestos.

Components with Refractory Ceramic Fibers

Parts containing refractory ceramic fibers.

Components with Radioactive Substances

Parts containing radioactive substances.

Tools Required for Disassembly

Torx Drivers

Various Torx driver sizes (T10, T15, T20) for disassembly.

Flat Head Screw Driver

Medium-sized flat head screw driver for component removal.

Soldering Iron

Soldering iron (TPK936) for specific component handling.

Product Disassembly Process

System Board Battery Removal

Step to remove the battery from the system board.

Capacitor Removal

Steps for removing capacitors larger than 2.5 cm from PCBs.