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HP ProLiant ML150 Installation Sheet

HP ProLiant ML150
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Figure 5 Removing the air baffle
Installing an accessory card
Figure 6 Installing an accessory card
Installing hard drives
This system can support SATA drives and SAS drives in non-hot-plug
and hot-pluggable hard disk drive cages.
Non-hot-plug drive installation
Figure 7 Removing a non-hot plug HDD cage
Figure 8 Installing a non-hot-plug drive
Hot-plug drive installation
Figure 9 Installing a hot-plug drive
Installing optical drives
The lower two half-height drive bays are shipped with drive bay
shields. Remove a shield by by pulling it away from the front of the
chassis (Figure 10).
Figure 10 Removing an optical drive bay shield
Figure 11 Installing an optical drive
Installing memory
Memory installation guidelines are as follows:
Use only registered ECC DDR2 533-/667-MHz DIMMs
Install DIMMs in identical pairs for best performance
A single DIMM can be installed in DIMM slot 1A or 2A.
Slot 5C and 6C can not be populated with a configuration
using four dual-rank DIMMs.
Table 3 Dual-Rank DIMM Configurations
1A & 2A 3B & 4B 5C & 6C
Dual Rank -- --
Dual Rank Single Rank --
Dual Rank Single Rank Single Rank
Dual Rank Dual Rank --
To access DIMM slots, remove the air baffle as shown previously.
CAUTION: To prevent damage to DIMMs, always use an
anti-static wrist strap and grounding mat, and discharge
static electricity before touching DIMMs.
If a DIMM does not fit completely or easily into the socket, remove
the DIMM, reverse the orientation, and reinsert.
Figure 12 Installing a DIMM
Installing a processor
This system supports Intel Xeon Dual Core 5200 series processors
and Intel Xeon Quad Core 5400 series processors. For a 2P system,
both processors must be of the same type. To access the processor
sockets, remove the air baffle as shown previously.
NOTE: When installing the processor, ensure that pin 1
of the processor is aligned with pin 1 of the socket.
Figure 13 Installing the processor
Figure 14 Installing the processor heatsink
NOTE: Ensure that the air flow arrow on top to the
heatsink is pointing toward the rear of the chassis.
Legal notices
© Copyright 2008 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice. The
only warranties for HP products and services are set forth in the express
warranty statements accompanying such products and services. Nothing
herein should be construed as constituting an additional warranty. HP shall
not be liable for technical or editorial errors or omissions contained herein.
Intel, Xeon, and Core are trademarks of Intel Corporation in the United States
and other countries.

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HP ProLiant ML150 Specifications

General IconGeneral
Tcase72.8 °C
Bus typeQPI
SteppingR2
FSB ParityNo
Scalability2S
Processor cache15 MB
Processor cores6
Processor modelE5-2603V3
System bus rate6.4 GT/s
Processor seriesIntel Xeon E5-2600 v3
Processor socketLGA 2011-v3
Processor codenameHaswell
Motherboard chipsetIntel C610
Number of QPI links2
Processor frequency1.6 GHz
Processor cache typeSmart Cache
Processor lithography22 nm
Processor manufacturerIntel
Processor package size52.5 x 45 mm
Processor front side bus- MHz
Processor operating modes64-bit
ECC supported by processorYes
PCI Express configurationsx4, x8, x16
Supported instruction setsAVX 2.0
Thermal Design Power (TDP)85 W
Number of processors installed1
Physical Address Extension (PAE)46 bit
Maximum number of PCI Express lanes40
Memory types supported by processorDDR4-SDRAM
Memory channels supported by processorQuad
Memory clock speeds supported by processor1600 MHz
Memory bandwidth supported by processor (max)51 GB/s
Maximum internal memory supported by processor768 GB
HDD size- \
RAID support-
HDD interfaceSerial ATA
Total storage capacity0 GB
Maximum storage capacity- TB
Number of HDDs installed0
Memory slots16x DIMM
Internal memory4 GB
Memory clock speed2133 MHz
Maximum internal memory256 GB
Memory layout (slots x size)1 x 4 GB
Graphics card familyNVIDIA
Intel® Virtualization Technology (Intel® VT)VT-d, VT-x
Ethernet interface typeGigabit Ethernet
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity4
Chassis typeRack (1U)
Power supply550 W
Processor ARK ID83349
Intel Secure Key Technology version1.00
Intel Identity Protection Technology version0.00
PCI Express slots version3.0
Weight and Dimensions IconWeight and Dimensions
Depth620 mm
Width200 mm
Height432.6 mm
Weight22230 g

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