HP u818x kit - Page 101

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限用物質含有情況標示聲明書
Declaration of the Presence Condition of the Restricted Substances Marking
單元Unit
限用物質及其化學符號
Restricted su
bstances and its chemical symbols
鉛 Lead
(Pb)
汞 Mercury
(Hg)
鎘 Cadmium
(Cd)
六價鉻
Hexavalent
chromium
(Cr
+ 6
)
多溴聯苯
Polybrominated biphenyls
(PBB)
多溴二苯醚
Polybrominated
diphenyl ethers
(PBDE)
主機外殼
○
○
○
○
○
○
線材
○ ○ ○ ○ ○ ○
電路板
○
○
○
○
○
○
芯片/電阻/
電容
○ ○ ○ ○ ○ ○
備考1.〝超出0.1 wt %〞及〝超出0.01 wt %〞係指限用物質之百分比含量超出百分比含量基準值。
Note 1：“Exceeding 0.1 wt %” and “exceeding 0.01 wt %” indicate that the percentage content of the restricted
substance exceeds the reference percentage value of presence condition.
備考2.〝○〞係指該項限用物質之百分比含量未超出百分比含量基準值。
Note 2：“○” indicates that the percentage content of the restricted substance does not exceed the percentage of
reference value of presence.
備考3.〝－〞係指該項限用物質為排除項目。
Note 3：The “−” indicates that the restricted substance corresponds to the exemption.