HP X2 210 G2 User Manual

Country/region Accredited agency Applicable note number
Sweden CEMKO 1
Switzerland SEV 1
Taiwan BSMI 4
The United Kingdom BSI 1
The United States UL 2
1. The exible cord must be Type HO5VV-F, 3-conductor, 1.0-mm conductor size. Power cord set ttings (appliance coupler and wall
plug) must bear the certication mark of the agency responsible for evaluation in the country or region where it will be used.
2. The exible cord must be Type SPT-3 or equivalent, No. 18 AWG, 3-conductor. The wall plug must be a two-pole grounding type
with a NEMA 5-15P (15 A, 125 V) or NEMA 6-15P (15 A, 250 V) conguration.
3. The appliance coupler, exible cord, and wall plug must bear a T mark and registration number in accordance with the Japanese
Dentori Law. The exible cord must be Type VCT or VCTF, 3-conductor, 1.00-mm conductor size. The wall plug must be a two-
pole grounding type with a Japanese Industrial Standard C8303 (7 A, 125 V) conguration.
4. The exible cord must be Type RVV, 3-conductor, 0.75-mm conductor size. Power cord set ttings (appliance coupler and wall
plug) must bear the certication mark of the agency responsible for evaluation in the country or region where it will be used.
5. The exible cord must be Type VCTF, 3-conductor, 0.75-mm conductor size. Power cord set ttings (appliance coupler and wall
plug) must bear the certication mark of the agency responsible for evaluation in the country or region where it will be used.
66 Chapter 10 Power cord set requirements

HP X2 210 G2 Specifications

General

Form factor	Convertible (Detachable)
Product type	Hybrid (2-in-1)
Product color	Silver
Country of origin	China
Stepping	C0
Tjunction	90 °C
Processor cache	2 MB
Processor cores	4
Processor family	Intel Atom®
Processor series	Intel Atom x5 Series
Processor socket	BGA 592
Processor codename	Cherry Trail
Processor frequency	1.44 GHz
Processor cache type	Smart Cache
Processor lithography	14 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor boost frequency	1.84 GHz
Processor operating modes	64-bit
PCI Express configurations	1x1
Scenario Design Power (SDP)	2 W
Maximum number of PCI Express lanes	1
Numeric keypad	No
Pointing device	Touchpad
Full-size keyboard	Yes
Internal memory	2 GB
Internal memory type	DDR3L-SDRAM
Memory layout (slots x size)	1 x 2 GB
Storage media	eMMC
Total storage capacity	32 GB
Compatible memory cards	MicroSD (TransFlash)
Display diagonal	10.1 \
Touch technology	Multi-touch
Display resolution	1280 x 800 pixels
Native aspect ratio	16:10
Number of execution units	12
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics
On-board graphics card base frequency	200 MHz
On-board graphics card dynamic frequency (max)	500 MHz
Battery capacity	32.5 Wh
Number of battery cells	2
AC adapter power	45 W
Audio decoders	DTS Studio Sound
Rear camera resolution (numeric)	5 MP
Wi-Fi standards	802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version	4.0
Charging port type	DC-in jack
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	0
Sustainability certificates	EPEAT Silver, ENERGY STAR
Processor code	SR29Z
Processor ARK ID	87383
Processor package size	17 x 17 mm
Intel Identity Protection Technology version	1.00

Weight and Dimensions

Depth	170 mm
Width	265 mm
Height	16.2 mm
Weight	1090 g
Height (tablet mode)	9.2 mm
Weight (tablet mode)	580 g