EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
including liquids, semi-liquids (gel/paste) and toner
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size ( if
applicable)
Description #1 Screw driver of "+" type
Description #2 Hexagonal nut screw driver for DVI and D-SUB connector
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove the Stand-base
2. Remove the Rear cover
3. Remove the pin and the screw
4. Remove the the tapes and the pins.
5. Remove the screws
6. Remove the Mylar
7. Remove the mainboard and powerboard
8. Remove the The mainframe
9. Remove the keyboard &bezel & panel
10.
11.
12.
13.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment ( with descriptions and arrows identifying locations) .