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HP Z38c - Page 2

HP Z38c
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EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 SCREW DRIVER(Plum flower head)
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove Hinge Ass’y by quick release button.
2. Remove screws and open the latches with tool to remove rear cover.
3. Remove screws and disconnect the cables.
4. Remove main frame ass’y.
5. Remove screws to separate the middle frame, metal parts and panel.
6. Open the latches with tool to remove back cover, and press the button to remove bottom cover.
7. Remove the screws and disconnect the connectors.
8. Remove the main board and power board.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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