HPE ProLiant ML110 Gen 10

MF877-00 Page 2
Template Revision A
HPE instructions for this template are available at MF877-01
Item Description
Notes
Quantity
of items
included
in product
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torx Driver
T-30
Philps screwdriver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. System Board Battery - Remove the top cover and locate the battery on the system board.
2. Capacitors in ATX power supply=> 2.5 cm () - Remove the power supply from the system with a T-15 torx driver. With
a #2 Philips screw driver remove the screws securing the top cover then locate the capacitors and pry from the PCB
with a flat head screw driver or Long Nose Plier () and dispose of properly.
3.
4.
5.
6.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
ML110 G10 System exploding drawing