IBM iSeries 810 User Manual

Possible failing
component FRU name Position
Type or
CCIN
number
(see the
Type,
model, and
part number
list)
Remove and
replace
procedure
Additional
comments
v System memory
v Memory card
Memory card A through H on
each processor/
memory card
3042 (See
page 529),
3043 (See
page 529),
3045, 3044
(See page
529), 3046
(See page
529)
Go to Model 825 -
Memory - A
through H
Disk unit Disk unit D01 through
D15
See the
Type, model,
and part
number list
Go to Model 825 -
Disk unit
(concurrent)
Tape unit Tape unit D17 See the
Type, model,
and part
number list
Go to Model 825 -
Removable media
- D17 and D18
Optical device Optical device D18 See the
Type, model,
and part
number list
Go to Model 825 -
Removable media
- D17 and D18
Air moving device (AMD) AMD B01, B02 See Final
assembly -
Model 825
Go to Model 825 -
Air moving device
(AMD) - B01; B02
(concurrent)
Power supply Power supply P01, P02 See Final
assembly -
Model 825
Go to Model 825 -
Power supply -
P01 and P02
Control panel Control panel NB1 250A (See
page 523)
Go to Model 825 -
Control panel -
NB1
Device board Device board DB1 See the
Type, model,
and part
number list.
Go to Model 825 -
Device board -
DB1
Device board Device board DB2, DB3, and
DB4
See the
Type, model,
and part
number list.
Go to Model 825 -
Device board -
DB2, DB3, and
DB4
Time of day battery Time of day
battery
CB1 - opposite
from C02 card
slot
See the
Type, model,
and part
number list.
Go to Model 825 -
Time of day
battery
Memory configuration
Analyze hardware problems 259

IBM iSeries 810 Specifications

General

Brand	IBM
Model	iSeries 810
Category	Server
Language	English