IBM System x3250 M5 4
Intel Intelligent Power Capability powers individual processor elements on and off as needed, to
reduce power draw.
Low-voltage Intel Xeon processors draw less energy to satisfy the demands of power and thermally
constrained data centers and telecommunication environments.
Low-voltage 1.35 V DDR3 memory UDIMMs consume up to 19% less energy compared to 1.5 V
DDR3 UDIMMs.
Solid-state drives may consume as much as 80% less power than traditional spinning 2.5-inch HDDs.
The server uses hexagonal ventilation holes, a part of IBM Calibrated Vectored Cooling™ technology.
Hexagonal holes can be grouped more densely than round holes, providing more efficient airflow
through the system.
Locations of key components and connectors
The following figure shows the front of the server with eight 2.5-inch hot-swap drive bays (models with
2.5-inch simple-swap or 3.5-inch simple-swap or hot-swap drive bays are also available).
Figure 2. Front view of the IBM System x3250 M5 with eight 2.5-inch hot-swap drive bays
The following figure shows the rear of the server with redundant hot-swap power supplies (models with
fixed power supply are also available).
Figure 3. Rear view of the IBM System x3250 M5 with hot-swap power supplies
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