Assembly Instructions for the Easy-PressFIT
Modules
About this document
Scope and purpose
This application note provides a guideline on how to use and implement Easy modules using PressFIT
connectors. The values and recommendations provided in this document should not be considered as
datasheet values.
Intended audience
This document is intended for all experts using Infineon Easy modules.
Table of contents
1 General information ....................................................................................................... 2
1.1 General information on power module handling .................................................................................. 3
2 Requirements for printed circuit boards ........................................................................... 4
3 The press-in process....................................................................................................... 6
3.1 Press-in tools ........................................................................................................................................... 6
3.1.1 Press-in tools for Easy modules with thermal interface material .................................................... 7
3.2 Press-in forces and speed ....................................................................................................................... 9
4 The press-out process ................................................................................................... 10
4.1 Press-out tools....................................................................................................................................... 10
4.2 Press-out forces ..................................................................................................................................... 11
5 Quality of PressFIT contacts ........................................................................................... 12
6 Mounting a PCB to the module ....................................................................................... 14
7 Condition of the heat sink for module assembly ............................................................... 15
8 Applying the thermal grease .......................................................................................... 16
9 Assembling the module on heat sink ............................................................................... 17
9.1 Assembling Easy1B/2B module on heat sink ....................................................................................... 17
9.2 Assembling Easy3B module on heat sink ............................................................................................. 19
10 System considerations .................................................................................................. 21
10.1 Module is already pressed into the PCB before mounting .................................................................. 21
10.2 Module is pressed into the PCB after mounting................................................................................... 21
11 Clearance and creepage distances .................................................................................. 22
12 Multi-module and automotive application ....................................................................... 24
12.1 Modules’ press-in process on the PCB .................................................................................................. 24
12.2 Modules and PCB mounting on the heat sink ...................................................................................... 26
12.3 Press-in and mouting only Easy3B modules with PCB and heat sink ................................................. 28
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