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Contents
1 Product Description
1.1 Overview........................................................................................ 11
1.1.1 Feature Summary ................................................................ 11
1.1.2 Board Layout ....................................................................... 13
1.1.3 Block Diagram ..................................................................... 15
1.2 Online Support................................................................................ 16
1.3 Processor ....................................................................................... 16
1.3.1 Intel D410 Graphics Subsystem.............................................. 17
1.4 System Memory .............................................................................. 18
1.5 Intel
®
NM10 Express Chipset............................................................. 19
1.5.2 USB ................................................................................... 20
1.5.3 SATA Support ...................................................................... 20
1.6 Real-Time Clock Subsystem .............................................................. 21
1.7 Legacy I/O Controller....................................................................... 21
1.7.1 Serial Port Headers............................................................... 21
1.8 LAN Subsystem............................................................................... 22
1.8.1 LAN Subsystem Drivers......................................................... 22
1.8.2 RJ-45 LAN Connector with Integrated LEDs .............................. 23
1.9 Audio Subsystem............................................................................. 24
1.9.1 Audio Subsystem Software .................................................... 25
1.9.2 Audio Connectors and Headers ............................................... 25
1.10 Hardware Management Subsystem .................................................... 26
1.10.1 Hardware Monitoring............................................................. 26
1.10.2 Thermal Monitoring .............................................................. 27
1.11 Power Management ......................................................................... 28
1.11.1 ACPI................................................................................... 28
1.11.2 Hardware Support ................................................................ 31
1.11.3 ENERGY STAR*, E-Standby, and ErP Compliance ...................... 34
2 Technical Reference
2.1 Memory Map................................................................................... 35
2.1.1 Addressable Memory............................................................. 35
2.2 Connectors and Headers................................................................... 38
2.2.1 Back Panel .......................................................................... 39
2.2.2 Component-side Connectors and Headers ................................ 41
2.3 BIOS Configuration Jumper Block....................................................... 49
2.4 Mechanical Considerations ................................................................ 51
2.4.1 Form Factor......................................................................... 51
2.5 Electrical Considerations................................................................... 52
2.5.1 Fan Header Current Capability................................................ 52
2.5.2 Add-in Board Considerations .................................................. 52