Technical Reference
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Table 36 provides maximum case temperatures for the board components that are
sensitive to thermal changes. The operating temperature, current load, or operating
frequency could affect case temperatures. Maximum case temperatures are important
when considering proper airflow to cool the board.
Table 36. Thermal Considerations for Components
Component Maximum Case Temperature
Processor For processor case temperature, see processor datasheets and
processor specification updates
Intel 82G965 GMCH 97
o
C (under bias)
Intel 82801HR/HH ICH8R/ICH8DH 105
o
C (under bias)
For information about Refer to
Processor datasheets and specification updates Section 1.2, page 15
2.12 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability
Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF
prediction is used to estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The Desktop Board
DG965MQ MTBF is 105,367 hours.
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